With the rapid development of very large-scale integration (VLSI) and flat panel display (FPD), the demands for sputtering target materials with high purity are greatly increased [1] . High purity Cu is one of the most commonly used metals for sputtering target [2] .Generally, the sputtering rate, deposited film quality and thickness uniformity are high when using a target with fine grains and small grain size difference [3] . Therefore,
Aluminum matrix composites reinforced by cerium oxide particles with different contents (0, 5%, 10%, 15% and 20%) were prepared by powder metallurgy. The morphology and structure of the composites were characterized by X-ray diffraction and scanning electron microscope. The corrosion behavior of CeO2 particle reinforced aluminum matrix composites with different content in 3.5% NaCl solution was tested by Tafel polarization curve. The results show that CeO2 is evenly distributed in the matrix, and the addition of CeO2 can effectively reduce the corrosion rate and improve the corrosion performance.
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