An approach to dividing the printed circuit board into parts to increase visibility of defects in a PCB image is considered. The approach is based on a piecewise linear approximation of a cumulative histogram. The last one is calculated for numbers of informative pixels placed in rows and columns of an image matrix. Informative pixels are those indicating contacts and C traces. The histogram demonstrates a distribution of informative pixels along the OX and OY axes. The beginning and ending points of linear lines are taken as coordinates of the divided parts of the PCB board. The flood-fill algorithm is used to color and separate the PCB chains components. The start pixels are taken from a set of informative pixels. To measure defect values, a mean intensity and gradient functions for the template and manufactured images are used. Distributed cumulative histograms are applied to PCB components to detect places and intensity of defects.
The numeral analytical method of analysis of the temperature fields of Flip-chip structures is described in the article. The problem of time reduction of the temperature analysis procedure of microelectronic device is considered. A problem is of current importance, since a problem of providing necessary temperature condition of device functioning is solved through frequent implementation of the temperature fields analysis. One of the effective methods of solving this problem is the use of the distributed calculations. The calculable chart of the temperature analysis method is described with the use of mechanism of the distributed calculations. The presented results of calculations specify on efficiency of application of the distributed calculations with a coefficient equal to 1,5.
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