The 2007 International Technology Roadmap for Semiconductors (ITRS) 1 specifies Extreme Ultraviolet (EUV) lithography as one leading technology option for the 32nm half-pitch node, and significant world wide effort is being focused towards this goal. Readiness of EUV photoresists is one of the risk areas. In 2007, the ITRS modified performance targets for high-volume manufacturing EUV resists to better reflect fundamental resist materials challenges. For 32nm half-pitch patterning at EUV, a photospeed range from 5-30 mJ/cm 2 and low-frequency linewidth roughness target of 1.7nm (3σ) have been specified. Towards this goal, the joint INVENT activity (AMD, CNSE, IBM, Micron, and Qimonda) at Albany evaluated a broad range of EUV photoresists using the EUV MET at Lawrence Berkeley National Laboratories (LBNL), and the EUV interferometer at the Paul Scherrer Institut (PSI), Switzerland. Program goals targeted resist performance for 32nm and 22nm groundrule development activities, and included interim relaxation of ITRS resist performance targets. This presentation will give an updated review of the results. Progress is evident in all areas of EUV resist patterning, particularly contact/via and ultrathin resist film performance. We also describe a simplified figure-of-merit approach useful for more quantitative assessment of the strengths and weaknesses of current materials.

By using the ultrahigh vacuum plasma enhanced chemical vapor deposition system to prepare nc-Si:H films with high conductivity, the experimental results show that the conductivity of nc-Si:H films increases with decreasing the mean grain size of films. Hence, there exists a small size effect on the conduction process. Based on the experimental data, we used the effective-medium theory to calculate the partial conductivity c of crystallites and i of the interface conductivity, respectively. Otherwise, we found that there existed two structure phase change point results from the effective-medium theory calculated for the materials of silicon films. The results suggest that the high conductivity of nc-Si:H films results mainly from the crystallites, and moreover, the interface region may serve as insulator layers. Thus, we may consider that the crystallites in nc-Si:H films act as quantum dots. In this paper, we present a heteroquantum dot tunneling model to discuss the transport process for the nc-Si:H films. Our calculated results agree very well with the experimental conductivity data for nc-Si:H films.

We have investigated the conductivity and photoconductivity response of undoped and Li-doped ZnGa2O4 epitaxial films grown using pulsed-laser deposition. A significant enhancement of the ultraviolet (UV) photoresponse is observed with Li doping that also correlates with an enhanced luminescent intensity. The wavelength dependence observed for creation of free carriers under UV excitation suggests that the transition is either band-to-band or involves a defect level near the band edge. Moderate n-type dark conductivity is observed for undoped films processed under reducing conditions. With Li doping, dark conductivity is reduced, suggesting that lithium ions in the zinc gallate lattice serve as deep acceptors. In addition, Li doping effectively eliminates persistent photoconductivity that is commonly observed in undoped films, suggesting the possible use of Li-doped ZnGa2O4 as a visible wavelength blind UV photodetector.

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