The problem involved in the increase of the chip output power of high-performance integrated electronic devices is the failure of reliability because of excessive thermal loads. This requires advanced cooling methods to be incorporated to manage the increase of the dissipated heat. The traditional air-cooling can not meet the requirements of cooling heat fluxes as high as 100 W/cm2, or even higher, and the traditional liquid cooling is not sufficient either in cooling very high heat fluxes although the pressure drop is small. Therefore, a new generation of liquid cooling technology becomes necessary. Various microchannels are widely used to cool the electronic chips by a gas or liquid removing the heat, but these microchannels are often designed to be single-layer channels with high pressure drop. In this paper, the laminar heat transfer and pressure loss of a kind of double-layer microchannel have been investigated numerically. The layouts of parallel-flow and counter-flow for inlet/outlet flow directions are designed and then several sets of inlet flow rates are considered. The simulations show that such a double-layer microchannel can not only reduce the pressure drop effectively but also exhibits better thermal characteristics. Due to the negative heat flux effect, the parallel-flow layout is found to be better for heat dissipation when the flow rate is limited to a low value while the counter-flow layout is better when a high flow rate can be provided. In addition, the thermal performance of the single-layer microchannel is between those of parallel-flow layout and counter-flow layout of the double-layer microchannel at low flow rates. At last, the optimizations of geometry parameters of double-layer microchannel are carried out through changing the height of the upper-branch and lower-branch channels to investigate the influence on the thermal performance.
High alkali and alkali earth metals (AAEMs) content in coal causes severe slagging and fouling during combustion in a boiler. In this study, the ash deposition behavior of a high-alkali coal at different bed temperatures and the effect of kaolin were investigated in a 30 kW circulating fluidized bed (CFB) test system using an ash slagging probe and deposition probe. The results show that the ash deposition tendency increases with the bed temperature. The condensation of Na 2 SO 4 is an important inducement for slag formation in the furnace. The melting or partial melting of slags is attributed to Na-Fe-Ca eutectics. At 920 C, Na 2 SO 4 will react with CaSO 4 to form the low-melting compound of Na 2 SO 4 -CaSO 4 . The deposited ash on the convection-heating surface consists of granular particles. On the windward side, the layered-structure ash deposits, i.e. the inner and outer layers, are formed at the bed temperature of 920 C but are absent at lower temperatures (820 C and 870 C). The formation of the inner layer consists of fine particles (<2 mm) and is closely related to Na 2 SO 4 . The size of the deposited ash in the outer layer is larger than 10 mm, while that on the leeward side is less than 10 mm. By adding kaolin in the coal, the slags are replaced by loose particles due to the absorption reactions between kaolin and alkali metals. The ash deposition tendency is improved and the optimal result is achieved when kaolin is added at an addition ratio of 3%.
Liquid cooling incorporating microchannels are used to cool electronic chips in order to remove more heat load. However, such microchannels are often designed to be straight with rectangular cross section. In this paper, on the basis of straight microchannels having rectangular cross section (SRC), longitudinal-wavy microchannel (LWC), and transversal microchannel (TWC) were designed, respectively, and then the corresponding laminar flow and heat transfer were investigated numerically. Among them, the channel wall of LWC undulates along the flow direction according to a sinusoidal function while the TWC undulates along the transversal direction. The numerical results show that for removing an identical heat load, the overall thermal resistance of the LWC is decreased with increasing inlet Reynolds number while the pressure drop is increased greatly, so that the overall thermal performance of LWC is inferior to that of SRC under the considered geometries. On the contrary, TWC has a great potential to reduce the pressure drop compared to SRC, especially for higher wave amplitudes at the same Reynolds number. Thus the overall thermal performance of TWC is superior to that of SRC. It is suggested that the TWC can be used to cool chips effectively with much smaller pressure drop penalty. In addition to the overall thermal resistance, other criteria of evaluation of the overall thermal performance, e.g., (Nu/Nu0)/(f/f0) and (Nu/Nu0)/(f/f0)1/3, are applied and some controversial results are obtained.
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