Precise micro-grinding machining was proposed to fabricate regular and controllable micro-grooved array structures on the surface of mold cores to realize the mass production and manufacturing of micro-structured polymer components by micro injection molding in this paper. First, the 3D topographies and section profiles of micro-ground mold cores and micro-formed polymers with different micro-structure parameters were presented. Then, the surface roughness of mold cores and polymers were compared. Next, the relationships between machining accuracy of mold core ground by micro-grinding and filling rates of micro-structured polymer formed by micro injection molding were investigated. Finally, the influences of micro injection molding parameters on the filling rate of micro-structures polymer were investigated. It is shown that the micro-structured polymer can be effectively and rapidly fabricated using the proposed method. The experimental results indicate the highest form accuracy of the micro-grooved mold core and the filling rate of micro-structured polymer can reach to 4.05 µm and 99.30%, respectively. It is found that the filling rate of the micro-structured polymer roughly increased with increasing machining accuracy of the mold core. The injection pressure had the greatest influence on the filling rate of the injection formed polymer, while the melt temperature had the least influence.
Reaction-bonded silicon carbide (RB-SiC) ceramic, one of the best candidates for large optical mirrors, is difficult to machine because of its high hardness and brittleness. A hybrid process called electrical discharge diamond grinding (EDDG) exhibits potential for improving the machinability of RB-SiC by combining electrical discharge machining (EDM) and diamond grinding. However, this hybrid process leads to damages that differ from those in conventional processes owing to the simultaneous actions of EDM and diamond grinding. In the present study, surface and subsurface damages induced by the interactions between EDM and diamond grinding during the EDDG of RB-SiC were examined. The effect of the discharge energy was considered.The surface and subsurface topographies and microstructures were characterized via scanning electron microscopy, Raman spectroscopy, and transmission electron microscopy. The EDM and grinding zones exhibited distinctive surface topographies and different dominant material removal mechanisms. An increase in the discharge energy facilitated ductile removal of the material and decomposition of SiC. Thus, a thinner subsurface damage layer was obtained compared with that in the less-thermally affected zone. The decomposed C and material migration tended to increase with the discharge energy. Owing to the interactions between EDM and diamond grinding, the subsurface was a mixture of amorphous/crystalline C, polycrystalline/nanocrystalline
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