An interlayer is in situ formed to regulate the morphologies and thickness of the polyamide layer during a chitosan assisted interfacial polymerization. The resulted NF membrane exhibits an ultrahigh permeability without compromising on selectivity.
Excellent electrical conductivity (EC) generally conflicts with high lap shear strength (LSS) for electrically conductive adhesives (ECAs) since EC increases while LSS decreases with increasing conductive filler content. In this work, the ECAs with the excellent overall performance are developed based on the ternary hybrid of Ag microflakes (Ag-MFs), Ag nanospheres (Ag-NSs), and Ag nanowires (Ag-NWs). First, a low silver content adhesive system is determined. Then, the effects of the relative contents of Ag fillers on the EC and the LSS are studied. It is shown that a small amount of Ag-NSs or Ag-NWs can dramatically improve the EC for the Ag-MF/epoxy adhesives. The Ag-NSs and Ag-NWs with appropriate contents have a synergistic effect in improving the EC. Meanwhile, the LSS of the as-prepared adhesive with the appropriate Ag contents reaches an optimal value. Both the EC and the LSS of the as-prepared ternary hybrid ECA with a low content of 40 wt % Ag are higher than those of the commercial ECAs filled with the Ag-MF content over 60 wt %. Finally, the ternary hybrid ECA with the optimal formulation is shown to be promising for printing the radio frequency identification tag antennas as an immediate application example.
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