The changes in direct current performance of circular-shaped AlGaN/GaN high electron mobility transistors (HEMTs) after 60Co γ-irradiation doses of 50, 300, 450, or 700 Gy were measured. The main effects on the HEMTs after irradiation were increases of both drain current and electron mobility. Compton electrons induced from the absorption of the γ-rays appear to generate donor type defects. Drain current dispersions of ∼5% were observed during gate lag measurements due to the formation of a virtual gate between the gate and drain resulting from the defects generated during γ-irradiation.

A through Si-substrate via-hole under the active area of GaN-based HEMTs grown on Si substrates is proposed to reduce the maximum junction temperature. Due to the large lattice mismatch between Si and GaN, an AlN nucleation layer and an AlGaN transition layer are required to grow GaN layers on Si substrates. This AlN nucleation layer is very defective and thermally resistive. The proposed through Si-substrate via-hole offers access to this AlN nucleation layer from the back side of the wafer. By removing this highly thermally resistive layer and plating the via hole with copper, the maximum junction temperature can be reduced from 146 to 120 °C at a power density of 5 W/mm. Besides reducing the maximum junction temperature of the HEMT, this through Si-substrate via-hole can be electrically connected to the source contact and act as a backside source field plate to reduce the maximum electric field around the gate edges and thereby increase the drain breakdown voltage. If this through Si-substrate via-hole is connected to the front gate pad, it can also behave as a back gate to improve front gate modulation.

The effect of low dose gamma irradiation on DC performance of circular-shaped AlGaN/GaN high electron mobility transistors weas investigated. The drain saturation current (IDS) increased 11.44% after irradiation with a dose of 700 Gy. Sheet resistance (Rs) was measured from transfer line method and it decreased 3.6% after irradiation. By extracting the resistance between source and drain in the drain I-V curve and combining with TLM data, mobility was found to increase 34.53% after irradiation. The mobility increase may come from the donor-type defects or the strain relaxation effect. Gate lag measurement was also performed and 5% current dispersion was found after irradiation with the dose of 700 Gy, indicating there were more defects generated after irradiation.

InAlN/GaN high electron mobility transistors were irradiated from the front side with 340 keV protons to a dose of 5 × 1013 cm−2. Raman thermography showed that the irradiated devices had higher channel temperatures than unirradiated control devices, but only by ∼10% under typical biasing conditions. Accordingly, the irradiated devices have higher thermal resistance (400 °C/W) compared to reference devices (350 °C/W), based on the slope of the power versus channel temperature line. However, increases of 42% in off-state drain breakdown voltage (VBR) and of >92% in critical voltage (Vcri) were observed for the proton irradiated HEMT. This is ascribed to the reduction of the peak electric field at the gate edges by ∼50% through the introduction of negative trap charges created from vacancies generated by the proton irradiation.

Proton irradiation from the backside of the samples were employed to enhance off-state drain breakdown voltage of AlGaN/GaN high electron mobility transistors (HEMTs) grown on Si substrates. Via holes were fabricated directly under the active area of the HEMTs by etching through the Si substrate for subsequent backside proton irradiation. By taking the advantage of the steep drop at the end of proton energy loss profile, the defects created by the proton irradiation from the backside of the sample could be precisely placed at specific locations inside the AlGaN/GaN HEMT structure. There were no degradation of drain current nor enhancement of off-state drain voltage breakdown voltage observed for the irradiated AlGaN/GaN HEMTs with the proton energy of 225 or 275 keV, for which the defects created by the proton irradiations were intentionally placed in the GaN buffer. HEMTs with defects placed in the two dimensional electron gas (2DEG) channel region and AlGaN barrier using 330 or 340 keV protons not only showed degradation of both drain current and extrinsic transconductance but also exhibited improvement of the off-state drain breakdown voltage. The Florida Object Oriented Device and Process Simulator Technology Computer Aided Design finite-element simulations were performed to confirm the hypothesis of a virtual gate formed around the 2DEG region to reduce the peak electric field around the gate edges and increase the off-state drain breakdown voltage.