This study uses air-filled hollow glass spheres (HGS) to study the dielectric constant of different high-frequency electric circuits following the evidence cited in our previous experiment, which found that air has a low dielectric constant (K), and is an excellent thermal insulating medium. A polytetrafluoroethylene (PTFE)/HGS composite board was fabricated using various proportions of PTFE as the matrix, and nitrogen gasfilled glass spheres as the fillers. In order to measure the dielectric properties of particular composites, composite boards were made from 60% solid content PTFE emulsion with HGS. A composite board was compounded with the help of a barbender with evenly spread HGS. To obtain a composites board, the gel was mixed in a blender and then molded and calendared to release bubbles and increase the surface uniformity. After cooling and sintering, this material formed a composites board. Furthermore, composite boards were made by the sandwich method, with one layer of PTFE emulsion mixed with HGS between two PTFE films. Several series of boards were made by varying a wide range of parameters, including the addition of different amounts of HGS powders, the powder size of HGS, and different fabrication procedures. All these parameters appeared to have varying effects on the dielectric properties. Both the dielectric constant and the dielectric loss factor were increased by additions of HGS loading. The amount of HGS was found to be 30%, which would achieve a dielectric constant of 1.65 and a dielectric loss factor of 0.0008. Both the dielectric constant and the dielectric loss factor were decreased by increasing the hollow pores; these factors reached minimal levels with 5000 rpm of blender rotation speed, then increased to add an HGS ball of 20 mm powder Downloaded from size with 1% loading to obtain the best conditions for the dielectric properties of PTFE/ HGS composite materials.
In order to fabricate and enhance the composites with dielectric functions, printed circuit boards (PCBs) were made from polytetrafluoroethylene (PTFE) gel after curing with 350°C. SiO2 and Al2O 3 nanopowders were used as the fillers and PTFE was the matrix used to fabricate the composites. A proposed stirring machine was used to conduct the compounding process, which can assist in the uniform distribution of nano-Al2O3 and nano-SiO2 powders in PTFE. The PTFE gel was mixed in the proposed stirring machine. Following stirring, molding and calendaring were done to release air bubbles and to increase the surface uniformity and smoothness of PCBs. Finally, PCBs were fabricated after cooling and sintering processes. Several kinds of PCBs were made by varying a wide range of fabrication parameters which included: percentage of particles added, size of particles added, different fabrication procedures, rotational speeds of the stirring machine, sintering, and cooling temperature, and calendaring times. Influences of these parameters and fabrication conditions on the dielectric properties of PCBs were investigated. This study established that there are some fabrication parameters due to which we get the worst dielectric properties of PCBs. Therefore, the optimum fabrication conditions and affecting factors of the board were investigated. As a result of this research, it was concluded that both dielectric constant and loss factor of the board were decreased by the addition of SiO2 and Al 2O3 nanoparticles and the optimum rotational speed of stirring machine is 3000 rpm. Dielectric properties of PCBs were increased at speeds above 3000 rpm.
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