In recent years, it has become clear that 1 μm or less sized fine air bubbles have different properties from those of mm or cm sized air bubbles. This study examined the effect of fine bubbles on the removal of salt fixed in the gap of aluminum plate as a verification of cleaning action by fine bubbles. As a result, it was confirmed that the removal effect of fixed salt is higher in fine bubble water than in control water, and that the degree of effect depends on the concentration of fine bubbles. It was also confirmed that less than 1 μm sized ultrafine bubble water has a higher removal effect than the control water. As a mechanism of removing fixed salt, it is conceivable that peeling effect, like lifting up part of fixed salt, in which fine bubbles are dissolved by pressure change around the fixed salt to become supersaturated, causing further bubbling around there, and/or physical collision effect of microbubbles. In addition, it was confirmed that the removal effect of a system in which fine bubbles were regularly introduced was much higher than the one that does not introduce fine bubbles regularly. In addition, even when the gap between fixed salt and aluminum plate was narrowed, the superiority of fine bubble cleaning was confirmed.
1992corrosion protection, metal coating, protective coatings corrosion protection, metal coating, protective coatings V 1550 -274Fluorine Passivation of Metal Alloy Surface with Volatile Reaction Enhanced Mechanism.-Fluoridation of Ni-P films electroless plated on Al (3.6-12 wt.% P) is performed at 350 • C by introducing 100% F2 gas in the reactor. The composition of the fluoride film is confirmed to be NiF2 and phosphorus is found to evaporate as PF5 during fluoridation. The activation energy of the fluoridation of Ni-P is found to decrease at a certain P-content, and therefore, this fluoridation process is referred as volatile reaction enhanced fluoridation. The NiF2 films are shown to be very resistant to corrosive gases and reactive gas plasma bombardment. The process may be very useful in the technology of semiconductor for fabrication. -(MAENO, M.; HIRAYAMA, R.; IZUMI, H.; MIKI, N.; CHIBA, K.; MIKASA, Y.; MATSUSHITA, H.; OHMI, T.; J.
Volatile reaction enhanced fluoridation of metal surface is shown to produce excellent passivated metal surfaces exhibiting complete resistance to corrosive gases and reactive gas plasma bombardment. Fluoridation is carried out on Ni‐P plated films on aluminum where the films contain 3.6–12 weight percent (w/o) phosphorus. Composition of the fluoride film on a Ni‐P surface is confirmed to be NiF2 where phosphorus is converted to PF5 , and PF5 is evaporated from the film during fluoridation, i.e., reaction of Ni‐P with fluorine gas. An activation energy of the fluoridation of Ni‐P film decreases with a certain amount of phosphorus concentration. Thus, this fluoridation is referred to by us as volatile reaction enhanced fluoridation. The NiF2 films are demonstrated to exhibit very strong resistance to corrosive gases and reactive gas plasma bombardment.
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