Demand for high speed, high density, small size, and multifunctional electronic devices has driven the development of 3D integration. Cu pillar bumps have received great attentions in ultra fine pitch 3D packaging. In this study, Sn-3.5Ag and Sn-58Bi cap bumps were fabricated on Cu pillar for fine pitch bonding of 3D packaging. Sn-Ag and Sn-Bi cap bumps with eutectic composition were fabricated with electroplating.
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