Diglycidyl ether of 9,9-bis(4-hydroxyphenyl) fluorene (DGEBF) was synthesized to introduce more aromatic structures into an epoxy resin system. The structure of DGEBF was characterized with Fourier transform infrared and 1 H-NMR. 4,4 0 -Diaminodiphenylmethane (DDM) was used as the curing agent for DGEBF, and differential scanning calorimetry was applied to study the curing kinetics. The glass-transition temperature of the cured DGEBF/DDM, determined by dynamic mechanical analysis, was 2608C, which was about 1008C higher than that of widely used diglycidyl ether of bisphenol A (DGEBA). Thermogravimetric analysis was used to study the thermal degradation behavior of the cured DGEBF/ DDM system: its onset degradation temperature was 3708C, and at 7008C, its char yield was about 27%, whereas that of cured DGEBA/DDM was only 14%.
The curing behaviour of a new epoxy curing agent, 2, 6-di (p-aminophenyl) benzo[1.2.5.4] bisoxazole (DIABO) was discussed. Diglycidyl-4, 5-epoxycyclohexane -1,2-dicarboxylate (TDE) was cured with a mixture of DIABO and diaminodiphenylsulfone (DDS). The aspects investigated including the curing procedure, reaction kinetics parameters and the heat resistance of the product. Average apparent activation energy of the resin's curing reaction was 63.55 kJ/mol, calculated according to the Kissinger and the Ozawa methods. The glass transition temperature was 261 °C and 257 °C determined by torsional braid analysis (TBA) and differential scanning calorimetry (DSC) respectively. The integral procedural decomposition temperature (IPDT) was 814 °C, respectively. Char residue was 44.58% at 572 °C. Compared to cure with TDE/DDS, these properties were improved by 18%, 8%, 30% and 50%, respectively.
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