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Mg–Cu alloys with different phases were electrodeposited in a molten LiCl–KCl eutectic mixture containing a small amount (0.5 mol %) of MgCl2 at 673 K. The electrochemical behavior of the MgII ion and alloy formation processes were studied at inert molybdenum (Mo) and active copper (Cu) electrodes in the molten salts, respectively. Different electrochemical techniques, such as cyclic voltammetry, square‐wave voltammetry, chronoamperometry, and open‐circuit potentiometry were carried out to investigate the electrochemical formation mechanism of Mg–Cu alloys. Three signals, corresponding to the formation of metal Mg and two different Mg–Cu alloy phases, are observed when using cyclic voltammetry, square‐wave voltammetry, and open‐circuit potentiometry. Chronoamperometry studies indicate the different interfacial properties of the magnesium metal versus the Mg–Cu alloys. The results of X‐ray diffraction and scanning electron microscopy show that the MgCu2 and Mg2Cu phases could be obtained at −2.30 and −2.38 V (vs. Pt), respectively.

CdSeS quantum dots (QDs) are firstly introduced into a NiO photocathode for photocathodic dye‐sensitized solar cells (p‐DSCs). The optimized sample exhibits a short‐circuit density (14.68 mA cm−2) and power conversion efficiency (1.02%) that are almost one order of magnitude higher than the reported value of p‐QDSCs. Steady‐state photoluminescence and time‐resolved photoluminescence measurements indicate that the photoexcited holes can be almost completely injected from CdSeS QDs into the valence band of NiO. At the same time, it can be observed from electrochemical impedance spectra measurements.

The IR‐drop in the full AMOLED display panel caused by the pixel current is simulated within the mainstream SPICE toolkit to evaluate the display uniformity. Each electrical part of the display panel is simplified and equalized to allow the SPICE doing the very large scale calculation. The implementation of the full panel simulation and the results give better understanding of AMOLED panel design.

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