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The materials selection for thermal management of electronic packaging is influenced by thermal, electrical, physical and thermomechanical requirements of the device and its surrounding electrical system and by the environment to which the device will be exposed. The reliability of the finished device and electric system will depend not only on the characteristics of the individual materials but also on the interaction of package and thermal management materials at interfaces during exposure to such stresses as thermal gradients, temperature cycling, moisture, and contamination. This chapter will introduce general characterization methodologies of thermal management materials for assessing performance and reliability of electronic packaging, including thermal properties, electrical properties, thermomechanical analysis, as well as material microstructure and interface characterization, surface finish and contact interface compatibility, and reliability analysis and environmental evaluation. Thermal Properties and Measurement TechniquesThe major thermal properties involved in the characterization of the thermal management materials for electronic packaging include thermal conductivity and diffusivity, specific heat capacity, coefficient of thermal expansion (CTE), and thermal shock resistance. A variety of measurement techniques have been developed to evaluate these properties for thermal management materials, here mainly focusing on some classic testing methods. Thermal Conductivity and DiffusivityThe accurate measurement and characterization of the thermal conductivity of bulk materials can pose many challenges. For instance, loss terms of the heat input intended to flow through the sample usually exist and can be most difficult to quantify. Many testing methods exist with an accuracy of within 5%, such as the X

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