With the continued miniaturization of devices in the semiconductor industry, atomic layer deposition (ALD) of silicon nitride thin films (SiNx) has attracted great interest due to the inherent benefits of this process compared to other silicon nitride thin film deposition techniques. These benefits include not only high conformality and atomic-scale thickness control, but also low deposition temperatures. Over the past 20 years, recognition of the remarkable features of SiNx ALD, reinforced by experimental and theoretical investigations of the underlying surface reaction mechanism, has contributed to the development and widespread use of ALD SiNx thin films in both laboratory studies and industrial applications. Such recognition has spurred ever-increasing opportunities for the applications of the SiNx ALD technique in various arenas. Nevertheless, this technique still faces a number of challenges, which should be addressed through a collaborative effort between academia and industry. It is expected that the SiNx ALD will be further perceived as an indispensable technique for scaling next-generation ultra-large-scale integration (ULSI) technology. In this review, the authors examine the current research progress, challenges and future prospects of the SiNx ALD technique.

Bi Fe O 3 ∕ Pb ( Zr 0.5 , Ti 0.5 ) O 3 (BFO/PZT) multilayer films have been grown on platinum-coated silicon substrate by chemical solution deposition. The remnant polarization is about 12μC∕cm2, which is much bigger than most of pure BFO thin films. P-E measurement shows that there are more obstacles affecting the motion of the domain wall in the multilayer films than those in the pure PZT films. This conclusion is also confirmed by measuring the dependence of capacitance with ac field under subswitching field. The frequency dependence of dielectric loss indicates that the dielectric loss (tanδ) of the multilayer is smaller than that of the PZT thin films at high frequency. Magnetic measurement indicates that the multilayer films are antiferromagnetic.

Hierarchical porous carbons (HPCs) hold great promise in energy-related applications owing to their excellent chemical stability and well-developed porous structures. Attention has been drawn toward developing new synthetic strategies and precursor materials that permit greater control over composition, size, morphology, and pore structure. There is a growing trend of employing metal–organic frameworks (MOFs) as HPC precursors as their highly customizable characteristics favor new HPC syntheses. In this article, we report a biomimetically grown bacterial-templated MOF synthesis where the bacteria not only facilitate the formation of MOF nanocrystals but also provide morphology and porosity control. The resultant HPCs show improved electrochemical capacity behavior compared to pristine MOF-derived HPCs. Considering the broad availability of bacteria and ease of their production, in addition to significantly improved MOF growth efficiency on bacterial templates, we believe that the bacterial-templated MOF is a promising strategy to produce a new generation of HPCs.

In this work, a novel chlorodisilane precursor, pentachlorodisilane (PCDS, HSiCl), was investigated for the growth of silicon nitride (SiN ) via hollow cathode plasma-enhanced atomic layer deposition (PEALD). A well-defined self-limiting growth behavior was successfully demonstrated over the growth temperature range of 270-360 °C. At identical process conditions, PCDS not only demonstrated approximately>20% higher growth per cycle than that of a commercially available chlorodisilane precursor, hexachlorodisilane (SiCl), but also delivered a better or at least comparable film quality determined by characterizing the refractive index, wet etch rate, and density of the films. The composition of the SiN films grown at 360 °C using PCDS, as determined by X-ray photoelectron spectroscopy, showed low O content (∼2 at. %) and Cl content (<1 at. %; below the detection limit). Fourier transform infrared spectroscopy spectra suggested that N-H bonds were the dominant hydrogen-containing bonds in the SiN films without a significant amount of Si-H bonds originating from the precursor molecules. The possible surface reaction pathways of the PEALD SiN using PCDS on the surface terminated with amine groups (-NH and -NH-) are proposed. The PEALD SiN films grown using PCDS also exhibited a leakage current density as low as 1-2 nA/cm at 2 MV/cm and a breakdown electric field as high as ∼12 MV/cm.

This paper reports a study on the enhanced H2 selectivity of SnO2 gas sensors with SiO2 on the surface of the sensors obtained via chemical vapor deposition using dirthoxydimethylsilane as the Si source. The gas sensors were tested for sensing performance towards ethanol, acetone, benzene, and hydrogen at operating temperatures from 150 °C to 400 °C. Our experimental results show that higher selectivity and responses to hydrogen were achieved by the deposition of SiO2 on the surface of the sensors. The sensor with SiO2 deposited on its surface at 500 °C for 8 h exhibited the highest response (Ra/Rg = 144) to 1000 ppm hydrogen at 350 °C, and the sensor with SiO2 deposited on its surface at 600 °C for 4 h attained the maximum response variation coefficient (D = 69.4) to 1000 ppm hydrogen at 200 °C. The mechanism underlying the improvement in sensitivity and the higher responses to hydrogen in the sensors with SiO2 on their surface is also discussed.

Correlations between physical properties linking film quality with wet etch rate (WER), one of the leading figures of merit, in plasma-enhanced atomic layer deposition (PEALD) grown silicon nitride (SiN x ) films remain largely unresearched. Achieving a low WER of a SiN x film is especially significant in its use as an etch stopper for technology beyond 7 nm node semiconductor processing. Herein, we explore the correlation between the hydrogen concentration, hydrogen bonding states, bulk film density, residual impurity concentration, and the WERs of PEALD SiN x using Fourier transform infrared spectrometry, X-ray reflectivity, and spectroscopic ellipsometry, etc. PEALD SiN x films for this study were deposited using hexachlorodisilane and hollow cathode plasma source under a range of process temperatures (270–360 °C) and plasma gas compositions (N2/NH3 or Ar/NH3) to understand the influence of hydrogen concentration, hydrogen bonding states, bulk film density, and residual impurity concentration on the WER. Varying hydrogen concentration and differences in the hydrogen bonding states resulted in different bulk film densities and, accordingly, a variation in WER. We observe a linear relationship between hydrogen bonding concentration and WER as well as a reciprocal relationship between bulk film density and WER. Analogous to the PECVD SiN x processes, a reduction in hydrogen bonding concentration arises from either (1) thermal activation or (2) plasma excited species. However, unlike the case with silane (SiH4)-based PECVD SiN x , PEALD SiN x WERs are affected by residual impurities of Si precursors (i.e., chlorine impurity). Thus, possible wet etching mechanisms in HF in which the WER is affected by hydrogen bonding states or residual impurities are proposed. The shifts of amine basicity in SiN x due to different hydrogen bonding states and the changes in Si electrophilicity due to Cl impurity content are suggested as the main mechanisms that influence WER in the PEALD processes.

Synthesis of good quality graphite on Ni using IC-PECVD at a low temperature of 380 °C in a hydrogen free environment.

Utilizing temperature dependent dielectric/impedance spectroscopy, multi-dielectric responses involving two dielectric relaxations (DRs) and two magnetic-order-associated dielectric anomalies were observed in polycrystalline DyMnO3. It is elucidated that both DRs’ dynamics, established in terms of equivalent circuit model and small polaron (SP) theories, are closely linked with localized SP migration features. Namely, low-temperature relaxation process can be attributed to short range polaronic variable-range-hopping induced dipolar-type relaxation in grains, whereas the higher-temperature one is due to Maxwell-Wagner relaxation at grain/grain boundary interfaces, which are governed by SP nearest-neighbor-hopping conduction. Additionally, magnetic-orders-associated dielectric anomalies may be assigned to strong spin-lattice couplings by magnetoelasticity-aroused lattice deformation.