An analytical solution is given for the self-heating conduction equation of a suspended one-dimensional (1D) object. The conductivity of the 1D object is given by combining Umklapp and second-order three-phonon processes. Using this analytical solution, several relations among some important parameters are discussed and are shown to be consistent with existing experimental results. A method to retrieve the coefficients for thermal conductivity is proposed for a general thermal conductor without knowing the detailed temperature profile along the 1D object.
A closed mini thermosyphon has been developed and studied experimentally. The aim of the study is to develop a simple closed circulation device for heat dissipation fiom electronic systems.The thermosyphon consists of an evaporator with two square flat surfaces of area 16 cm2 each, and a condenser equipped with an m y of external tapered fins for enhanced heat dissipation.Experiments have been conducted on the thermosyphon to study its performance at various heating levels, with natural and forced convection at the condenser section. Transient and steady state temperature profiles along the walls of the thermosyphon are measured at various heat inputs. Results show that the thermosyphon under study allows a heat dissipation rate up to 1.44 Wlcm' under forced convection, without exceeding moderate levels of temperature, in the range of air velocities used.
To control and utilize thermal energy more precisely, an asymmetric thermal rectifier is designed in this paper. Through molecular dynamics calculations, it is found that the device has obvious thermal rectification phenomenon. The equivalent thermal conductivity of the device increases gradually with temperature. The thermal rectification coefficients at different temperatures are calculated, and it is found that the thermal rectification coefficients fluctuated wildly with temperature. The temperature distribution map inside the device and the fact that the thermal conductivity of the device increases with temperature indicate that the asymmetry of radial heat transfer and the interlayer coupling determine this thermal rectification property.
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