Stem cell therapy has shown unparalleled potential in tissue engineering, but it still faces challenges in the regulation of stem cell fate. Inspired by the native stem cell niche, a...
An increasing utilization of nuclear energy and radiation medicine urged flexible neutrons shielding materials for personal protection. However, it was a challenge to manufacture neutron shielding materials with good flexibility...
In the manufacturing field of high-frequency print circuit boards (HFPCBs), traditional adhesive films (such as epoxy resin and polyimide adhesive films) have attracted enormous attention because of their superior adhesive property. However, their molecular chains intrinsically contained numerous polar groups (carboxyl, carbonyl, and amino), which markedly increased the dielectric constant (D k ) and dielectric loss (D f ) of the adhesive film, causing miserable deterioration of the fidelity and transmission rate of signals. In this work, a novel sandwich-like adhesive film was felicitously designed and fabricated by double-sided coating. The core layer as a supporting structure was a polytetrafluoroethylene film with a low dielectric constant and low dielectric loss, and the surface layer as a principal part of the adhesive function was polybutadiene with high vinyl content. Moreover, to further improve the interfacial adhesive strength between the adhesive film and copper foil, the fluorine-containing groups were controllably introduced onto the surface of the sandwich-like adhesive film via environment-friendly plasma treatment. Based on low polarizability and only superficial distribution of the fluorine-containing groups, the interfacial adhesive strength of the film greatly improved from 0.41 to 1.09 N/mm. Unexpectedly, the high-frequency dielectric properties slightly changed (without treatment D k = 2.42 and D f = 0.0036 at 10 GHz, treatment D k = 2.46 and D f = 0.0039 at 10 GHz). This work provided the key adhesive materials for the next generation of high-throughput data transmission equipment, remote sensing controllers, and unmanned aerial vehicles in high-frequency ranges.
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