Stretchable strain sensors based on nanomaterial thin films have aroused extensive interest for the strain perception of smart skins. However, it still remains challenging to have them achieve high sensitivity over wide linear working ranges. Herein, we propose a facile strategy to fabricate stretchable strain sensors based on Au/graphene composite films (AGCFs) with hierarchical cracks and demonstrate their superior sensing performances. The polydimethylsiloxane substrates were covered with self-assembled graphene films (SAGFs) and sputtered with Au, and then prestretching was applied to introduce hierarchical cracks. The AGCF strain sensors exhibited high sensitivity (gauge factor (GF) ≈ 153) and favorable linearity (R 2 ≈ 0.9975) in the wide working range (0–20%) with ultralow overshooting (∼1.7% at 20%), fast response (<42.5 ms), and also excellent cycling stability (1500 cycles). Besides, these patternable sensors could further achieve higher GF (∼320) via pattern designing. The dominant effect of the intermediate wrinkled SAGFs in forming hierarchical cracks was studied, and the linear sensing mechanism of the as-formed fractal microstructures was also revealed in detail. Moreover, the AGCF strain sensors were tested for motion monitoring of the human body and electronic bird. Due to the remarkable versatility, scalable fabrication, and integration capability, these sensors demonstrate great potential to construct smart skins.

Multilayered, highly ordered, and heterogeneously constructed flexible composite film can greatly reduce secondary electromagnetic pollution and maintain effective EMI shielding performances under large tensile strain.

Based on microstructure of as-cast Ti-6Al-4V titanium alloy, an image processing to simplify model of β grain size, α lamella space was developed and a quantitative statistical method of β grain size, α lamella space in two-phase titanium alloys was established, with which β grain size and α lamella space of as-cast Ti-6Al-4V titanium alloy with different plate thickness were analyzed. The relationship between β grain size, α lamellar space and cast plate thickness was discussed. The results show that β grain size and α lamellae thickness nearly linearly increase as plate thickness increasing. β grain size has normal distribution and with cast plate thickness increasing, the dispersion gets larger.

As for the mass data and record process variables produced during the aircraft digital manufacturing project, the information interactive model based on XML in the aircraft manufacturing project management is proposed from a new aspect. By establishing the independent interactive module between CIP(Central Information Platform) and Heterogeneous Database, using JDOM to visit and operate the mapping between XML document and relational database, a standard interface with good expansibility in different platforms for exchanging data is given in the article which greatly improves the information sharing and integration efficiency of aviation enterprise.

We successfully prepared highly anisotropic conductive composites (ACCs) made of Ag-coated glass microbeads/ UV adhesive via electric field-induced alignment, which was achieved using custom patterned microelectrode arrays. An optimized AC electric field (2 kV/cm, 1 kHz) with pole-plate spacing (50 μm) was utilized to effectively assemble the microbeads into chain arrays, which were precisely positioned on the microelectrode arrays to construct ordered conductive channels. In this case, tangling and cross-connection of the assembled microchains could be reduced, resulting in enhanced performance of the ACCs with high conductivity as well as excellent anisotropy. With a minor loading (3 wt %), the conductivity in the alignment direction could reach ∼24.9 S/m, which was the highest among the reported ACCs to the best of our knowledge, and it could also be 6 orders of magnitude higher than that within the plane. Besides, the samples exhibited high reliability in wire connections with low resistances. Due to these fascinating properties, the ACCs demonstrate promising applications for reliable electrical interconnects and integrated circuits.