Here, we introduce deep eutectic solvent (DES)-silica composites as a promising candidate for solid composite electrolytes (SCEs). The proposed DES-based gel electrolytes, further referred to as eutectogels (ETGs), are characterized by high ionic conductivity (1.46 mS cm-1), thermal (up to 130 °C), and electrochemical stability (up to 4.8 volts) and are chemically inert to solvents and water. These ETGs can be easily processed and potentially at lower costs compared to ionicliquid-based composite electrolytes. The good prospects of ETGs for application in Li/Li-ion batteries are demonstrated by stable cycling of Li/ETG/LiFePO4 cells over 100 cycles at C/10.
The fast and scalable low-temperature deposition of nanoscale metallic features is of the utmost importance for the development of future flexible smart applications including sensors, wireless communication and wearables. Recently, a new class of metalorganic decomposition (MOD) copper inks was developed, consisting of self-reducing copper formate containing amine complexes. From these novel inks, copper metal features with outstanding electrical conductivity (± 10 μΩ cm) are deposited at temperatures of 150 °C or less, which is well below the reduction temperature of orthorhombic α-copper formate (around 225 °C). However, the underlying principle of this reaction mechanism and the relationship between the corresponding temperature shift and the amine coordination is still under debate. The current study provides a full explanation for the shift in reduction temperatures via in-situ characterization. The results clearly indicate that the structural resemblance and stability of the Cu(II) starting compound and the occurring Cu(I) intermediate during the in-situ reduction, are the two main variables that rationalize the temperature shift. As such, the thermal compatibility of the copper MOD inks with conventional plastic substrates like polyethylene terephthalate (PET) can be explained, based on the metalorganic complex properties.
Silver nanoparticle inkjet inks are commonly used to print electrically conductive patterns, such as sensors or electrodes in organic light emitting diodes (OLEDs) or organic photovoltaic devices (OPVs). After printing, a sintering step is required to transform the printed layer into an electrically conductive one. Gaining more insight into the occurring phenomena during this post‐treatment step is necessary when applying different kinds of inkjet ink. Therefore, in this work the commercially available silver nanoparticle inkjet ink Metalon JS‐B30G from Novacentrix is characterised during the different stages in the printing and thermal sintering sequence. The pre‐printing and post‐sintering characterisation proves that the inkjet ink used has got the right material parameters, such as viscosity and particle size. Silver layers with sheet resistances of 40 mΩ/sq were obtained with an average roughness lower than 10 nm. The experiments performed show the different stages during the thermal sintering procedure. Based on this, suitable thermal sintering parameters are defined leading to application of these conductive silver layers in OLEDs.
Using a colloidal suspension, electrochemically active tungsten oxide thin films (150 nm) have been prepared via ultrasonic spray deposition using two different current collectors, namely TiN and Pt.
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