The mechanical properties and microstructure of layered Cu/Al/Cu composites was investigated after annealing at various temperatures. The nature of intermetallic compounds in roll-bonded Cu/Al/Cu clad metals after heat treatment was investigated using SEM, XRD and EBSD.in the temperature range 200~500oC. In the roll-bonded 3-ply Cu/Al/Cu clad metal, no visible interfacial reaction compound and defects were observed at the interfaces. The reaction layer was observed grow rapidly at the Cu/Al interface after annealing at and above 400oC, which deteriorated the ductility of clad metals. Intermetallic reaction layers of Cu/Al/Cu clad materials annealed at 500oC for 3, 5, 10hours was found to consist of three layers, CuAl2, CuAl and Cu9Al4. EBSD analyses revealed that intermetallic layers are polycrystalline. The drastic decrease of stress and elongation in Cu/Al/Cu clad composite annealed at 500oC can be linked to the interfacial cracks between Al and Cu layer.
Creep properties of stress relieved Zr-1Nb-0.75Sn-0.1Fe alloy with a lower Sn content were studied. Zr-1Nb-0.75Sn-0.1Fe alloy was found to have stress exponents of 6-7, independent of stress level, unlike Zr-1Nb-1Sn-0.1Fe alloy, in which the transition of stress exponent with increase of stress was observed. The constancy of stress exponent, without the transition observed in Zr-1Nb-0.75Sn-0.1Fe alloy with lower Sn content, is associated with the decrease of Sn atoms. The activation energies for creep defor mation were calculated to be between 210 and 260 kJ/mol for the Zr-1Nb-0.75Sn-0.1Fe alloy with a lower Sn content. The slightly smaller creep activation energy in Zr-1Nb-0.75Sn-0.1Fe, compared with that of Zr-1Nb-1Sn-0.1Fe alloy, is thought to be attributed to the lower Sn content. The creep data obtained at different temperatures and stress fell close to a single line, suggesting the creep life of Zr-1Nb-0.75Sn-0.1Fe alloy with a lower Sn content is well expressed by the Larson-Miller Parameter.
The tensile mechanical performance and ductility of Cu/Al/Cu clad composite were studied. Brittle interfacial reaction compounds were observed at Cu/Al interfaces after annealing at 500°C. The ultimate tensile strength of the tri-layered Cu/Al/Cu clad plates is in close agreement with those calculated from the UTS data of separated Cu and Al layers using the rule of mixture. The loss of ductility in Cu/Al/Cu and separate Cu upon annealing at 500°C is associated with the brittle intermetallic layer. The greater ductility of as-roll-bonded Cu/Al/Cu than those of both Cu and Al is linked to the excellent interface bonding after roll-bonding. Excellent bonding at Cu/Al interface is prerequisites for improvement ductility of clad composite.
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