We demonstrate the fabrication of N-face GaN nanorods by metal organic vapour phase epitaxy (MOVPE), using continuous-flux conditions. This is in contrast to other approaches reported so far, which have been based on growth modes far off the conventional growth regimes. For position control of nanorods an SiO(2) masking layer with a dense hole pattern on a c-plane sapphire substrate was used. Nanorods with InGaN/GaN heterostructures have been grown catalyst-free. High growth rates up to 25 microm h(-1) were observed and a well-adjusted carrier gas mixture between hydrogen and nitrogen enabled homogeneous nanorod diameters down to 220 nm with aspect ratios of approximately 8:1. The structural quality and defect progression within nanorods were determined by transmission electron microscopy (TEM). Different emission energies for InGaN quantum wells (QWs) could be assigned to different side facets by room temperature cathodoluminescence (CL) measurements.

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Vertically aligned GaN nanorods have recently obtained substantial interest as a new approach to solid state lighting. In comparison to conventional planar LEDs, 3D NanoLEDs are expected to offer substantial advantageous: very low defect density, quasi free‐standing, no strain due to mismatch of thermal expansion coefficients, no substrate bending even when grown on large area silicon. Core‐shell strategies are another very interesting aspect. The active LED surface per wafer could be increased by more than one order of magnitude. However, most of these advantages have not yet been proven in real devices, which would include a quantitative comparison of light emission. Related to the 3D character, there are also technological risks. In the following we will discuss the main developments which have paved the way up to this point, including a detailed discussion of possible benefits and risks connected with the NanoLED approach (© 2011 WILEY‐VCH Verlag GmbH & Co. KGaA, Weinheim)

We identify a quantum well internal high density Augerlike loss process as the origin of the so called ‘droop’ of internal quantum efficiency (IQE) in InGaN based light emitters. The IQE of such a device peaks at small current densities and then monotonously decreases towards higher currents. The origin of this ‘droop’ has been widely discussed recently and many possible mechanisms have been proposed for explaining the effect. We compare temperature and carrier density dependent electroluminescence and photoluminescence measurements of a green emitting single quantum‐well (SQW) LED over a wide parameter range. The carrier‐density as well as temperature dependence of efficiency is identical in both measurements, indicating that the decrease is due to a high density quantum‐well internal loss process. The data can be accurately modeled assuming an Auger‐like loss process with C = 3.5 × 10–31 cm6s–1. We suggest phonon‐ or defect‐assisted Auger recombination as the origin of this loss‐channel. The high current performance can be improved if a thick InGaN SQW or a multi quantum‐well (MQW) is used. This is in very good agreement with theoretical simulations (© 2009 WILEY‐VCH Verlag GmbH & Co. KGaA, Weinheim)