The effects of cure temperature history on the stability of hinged structure poly (4,4-oxydiphenylene pyromellitimide) (PMDA-ODA) polyimide were studied by dynamic mechanical analysis. The polyimide films were cured under different curing conditions and peeled off by substrate etching. It was found that a proper cure time and temperature ramp rate improves the stability in terms of higher glass transition temperature. Ninety minutes at 375 ı C or 200 ı C is a beneficial high glass transition temperature. The temperature ramp rate should be between 2 ı C/min and 10 ı C/min, which is neither too high nor too low.
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