Functional polymethylmethacrylate (PMMA)/graphene nanocomposite microcellular foams were prepared by blending of PMMA with graphene sheets followed by foaming with subcritical CO(2) as an environmentally benign foaming agent. The addition of graphene sheets endows the insulating PMMA foams with high electrical conductivity and improved electromagnetic interference (EMI) shielding efficiency with microwave absorption as the dominant EMI shielding mechanism. Interestingly, because of the presence of the numerous microcellular cells, the graphene-PMMA foam exhibits greatly improved ductility and tensile toughness compared to its bulk counterpart. This work provides a promising methodology to fabricate tough and lightweight graphene-PMMA nanocomposite microcellular foams with superior electrical and EMI shielding properties by simultaneously combining the functionality and reinforcement of the graphene sheets and the toughening effect of the microcellular cells.
As the portable device hardware has been increasing at a noticeable rate, ultrathin thermal conducting materials (TCMs) with the combination of high thermal conductivity and excellent electromagnetic interface (EMI) shielding performance, which are used to effi ciently dissipate heat and minimize EMI problems generated from electronic components (such as high speed processors), are urgently needed. In this work, graphene oxide (GO) fi lms are fabricated by direct evaporation of GO suspension under mild heating, and ultrathin graphite-like graphene fi lms are produced by graphitizing GO fi lms. Further investigation demonstrates that the resulting graphene fi lm with only ≈8.4 µm in thickness not only possesses excellent EMI shielding effectiveness of ≈20 dB and high in-plane thermal conductivity of ≈1100 W m −1 K −1 , but also shows excellent mechanical fl exibility and structure integrity during bending, indicating that the graphitization of GO fi lm could be considered as a new alternative way to produce excellent TCMs with effi cient EMI shielding.
Novel high-performance polyetherimide (PEI)/graphene@Fe3O4 (G@Fe3O4) composite foams with flexible character and low density of about 0.28-0.4 g/cm(3) have been developed by using a phase separation method. The obtained PEI/G@Fe3O4 foam with G@Fe3O4 loading of 10 wt % exhibited excellent specific EMI shielding effectiveness (EMI SE) of ~41.5 dB/(g/cm(3)) at 8-12 GHz. Moreover, most the applied microwave was verified to be absorbed rather than being reflected back, resulting from the improved impedance matching, electromagnetic wave attenuation, as well as multiple reflections. Meanwhile, the resulting foams also possessed a superparamagnetic behavior and low thermal conductiviy of 0.042-0.071 W/(m K). This technique is fast, highly reproducible, and scalable, which may facilitate the commercialization of such composite foams and generalize the use of them as EMI shielding materials in the fields of spacecraft and aircraft.
The fabrication of low-density and compressible polymer/graphene composite (PGC) foams for adjustable electromagnetic interference (EMI) shielding remains a daunting challenge. Herein, ultralightweight and compressible PGC foams have been developed by simple solution dip-coating of graphene on commercial polyurethane (PU) sponges with highly porous network structure. The resultant PU/graphene (PUG) foams had a density as low as ∼0.027-0.030 g/cm(3) and possessed good comprehensive EMI shielding performance together with an absorption-dominant mechanism, possibly due to both conductive dissipation and multiple reflections and scattering of EM waves by the inside 3D conductive graphene network. Moreover, by taking advantage of their remarkable compressibility, the shielding performance of the PUG foams could be simply adjusted through a simple mechanical compression, showing promise for adjustable EMI shielding. We believe that the strategy for fabricating PGC foams through a simple dip-coating method could potentially promote the large-scale production of lightweight foam materials for EMI shielding.
High-density polyethylene (HDPE) was reinforced with expanded and untreated graphite in a meltcompounding process. Viscosity increased upon addition of graphite phase, with the expanded graphite (EG) showing more dramatic rise than the untreated graphite (UG) in viscosity. The increase in viscosity was attributed to the increased surface-to-volume ratio for the EG filler after acid treatment. Electrical conductivity also increased from that pertaining to an insulator to one characteristic of a semiconductor. The EG system showed a lower percolation threshold for transition in conductivity compared to that in the UG system. DSC results indicated that the fillers acted as a nucleating agent in inducing the crystallization of HDPE in the composites. However, the overall degree of crystallinity and melting temperature of HDPE decreased with the addition of EG and UG. Mechanical properties improved as a function of filler content but the overall enhancement was not impressive. It was conjectured that the filler-matrix interface was not optimized in the melt-mixing process. However, the role of EG as a reinforcement phase for both electrical and mechanical properties was unambiguously established. The EG composites demonstrated potentially useful attributes for antistatic, barrier, mechanical, electrical, and cost-effective applications.
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