For the system of a large-area laser projection image exposure using 351nm XeF excimer, its constitution, optical design parameters, and manufacturing process are introduced. The system is capable of patterning in photoresists for large-format products, with feature sizes ranging from 10 µm to below 1µm and substrate sizes ranging from 100×100mm to 600×900mm. 351nm excimer is used in this system because of its capability for exposure of conventional photoresists. Large-area lithography refers to the patterning on such areas with the desired resolution and seamless scanning. Along with the demands for lithography equipment that can provide high-resolution imaging capability, high-precision alignment performance and lower manufacturing costs, it is important for us to design and manufacture such equipment. Some key problems such as laser illumination optics, projection optics, positioning and controlling machinery, are described here. The existing problem and solutions in the optics and machinery are analyzed and discussed.
New approaches are applied to overcome the difficulty of accurate angle measurements in specklegram information processing by introducing a prism rotator for compensation and by using symmetry evaluation. Together with slit scanning and the fast Fourier transform procedure, speckle random noise has been effectively suppressed, and accurate measurements of Theta and s are achieved. The method we present makes it possible to process the specklegram information automatically. The experimental setup is described in detail. The principles and experimental curves are given.
One kind of LED backlight module used for large-size TFT-LCD to apply in the direct illumination-type backlight source is designed by theoretical analysis and software simulation, and it is also confirmed such 15-inch backlight source can provide uniform illumination. The LED light intensity is estimated according to backlight module surface's brightness. A LED illumination model in Tracepro is established to study its illumination distribution. It is found the illuminance is most uniform when the mixed cavity thickness is 20mm and the backlight source LED spacing 20mm. Simultaneously the promotion to the LED backlight source array, its optics uniformity achieves 85%. By adding a lens for each LED to design those according to the Tracepro interactive optimized tool, the mixed light space can be reduced to 5-10mm.
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