In this study, a micro-force tensile testing machine (MTS Tytron 250) was applied to test the polyimide samples coated with different thicknesses of copper (500–1500 nm). The experiments using different strain rates (1.6 × 10−4 to 1.6 × 10−2 s−1) were conducted to the test vehicles. The results showed that the stress and strain of Cu films were strongly correlated with the strain rate and film thickness. The mechanical strength, yield stress, Young’s modulus, and maximum tensile stress, increase as the strain rate increases or the thickness decreases. Strain rate sensitivity rapidly increases as the thickness decreases from 750 to 500 nm to imply that the workhardening rate increases while the thickness decreases, resulting in a higher probability of brittle failure.
The objective of this study is to investigate the mechanical behavior of copper thin film with different thicknesses subjected to varying strain rates. A micro-force tensile testing machine (MTS Tytron 250) was used to test the polyimide samples coated with different thicknesses of copper (500 nm, 750 nm, 1000 nm, and 1500 nm). The experiments were conducted by applying test vehicles to different strain rates (1.6×10-4s-1, 1.6×10-3s-1, and 1.6×10-2s-1). The experimental results showed the strain rate and the thickness have obvious influence upon the mechanical properties of Cu thin film. The yield stress increases as increasing the strain rate or decreasing the thickness of Cu film. For considering the strain rate sensitivity m, the strain rate sensitivity m is found that it increases as decreasing the thickness to imply that Cu film has high strain-rate response at low thickness.
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