In this paper a systematic approach is presented for the design and optimization of forced liquid cooled electronic modules with high power dissipation. The steps of the design cycle include hydrodynamical evaluation of the heat sink, thermal management, thermomechanical optimization and especially lifetime prediction of soldered joints. Utilized engineering tools comprise Computational Fluid Dynamics, Finite Differences and Finite Element programs. These are coupled via software interfaces in order to enable data exchange as well as efficient cooperation of the designers. Applying these deans, performance, reliability and costs of a certain module have been optimized. By use of a design-for-reliability procedure substantial savings with regard to development time, prototyping effort and consequently costs can been achieved.. .
Der Beitrag beschäftigt sich mit Strategien und Algorithmen für die optimale Gangwahl bei Kraftfahrzeugen mit automatisiertem Getriebe. Zum Zweck der Simulation wurde ein vorausschauendes Fahrermodell entwickelt. Darüber hinaus entstand eine Funktion zur Prädiktion der Fahrzeug-Geschwindigkeit, welche sowohl in der Simulation als auch im endgültigen prädiktiven Schaltalgorithmus verwendet wird. Der Aufbau wird beschrieben und die Funktion sowohl in der Simulation als auch auf der Straße getestet.
Straightforward air cooling of semiconductor devices has gradually been replaced by methods using liquid coolants, especially water cooling. In the work described more efficient cooling devices than the already existing for hockey-puck and module type semiconductors are suggested. An existing heat sink made of aluminium nitride for the water-cooling of hockey-puck type semiconductors has been used as a basis for the development of high performance heat sinks for increased heat flux densities. By means of thermal and fluid dynamics simulation tools the internal geometry has been optimized with regard to improved heat transfer and reduced pressure drop. The simulation results have been confirmed by a number of experiments using various measuring techniques. As an alternative cooling method for semiconductor modules a modified baseplate comprising a number of fins for direct water cooling has been suggested. For an intelligent temperature management control algorithms have been developed resulting in a prototype ASIC which has been implemented for testing purposes.
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