The paper reports on a self-assembly process that enables both self-alignment of microelectronic devices and self-interconnection of devices with the surrounding electrical wiring. The complete process was successfully demonstrated using state-of-the-art RFID devices (radio frequency identification device) which were self connected to four metal pads on polymer foil substrates.The new self-assembly concept comprises the following steps: mask-less plasma patterning process to define target areas for die assembly on polymer tapes, application and self-alignment of a liquid assembly medium at the target area, dropping of the chip device onto the assembly liquid, self-orientation of the chip with respect to the contact pads and finally heat induced bonding and interconnection of the device. Self-assembly of microelectronic componentsThe term self-assembly is generally used to identifY processes which enable objects to arrange themselves in predetermined structures.In the field of microelectronics researchers are aiming for new chip assembly principles that work independent of mechanically controlled machines such as equipments for pick and place or wire bonding. Self-assembly would help to significantly reduce cost in microelectronic packaging. Furthermore, there is also a fundamental need to look for new assembly concepts: the ongoing miniaturization in semiconductor technology and the related shrinkage in die size. Consequently, there is an increasing demand for high throughput handling of chips which have a size of just a few hundreds of micrometers.One typical example would be assembly of RFID devices in huge quantities and at a nearly evanescent cost level. A prominent example of self-assembly of functional silicon devices was introduced by the US company Alien Technologies [I]. According to their concept small silicon chips are delivered in large quantities in a constant stream of liquid which flows over a substrate that shows specific surface topography. The pyramidal shape of the silicon devices allows for a self-controlled placement of the dies at their target positions.Within the last years several working groups presented self-assembly processes that use capillary forces for self-alignment of silicon devices [2,3]. Most of these self-assembly techniques are working in liquid environment and require delivery of chips in overplus in order to fill all assembly sites by functional components [4,5].