The public reporting burden for this collection of information is estimated to average 1 hour per response, including the time for reviewing instructions, searching existing data sources, gathering and maintaining the data needed, and completing and reviewing the collection of information. Send comments regarding this burden estimate or any other aspect of this collection of information, including suggestions for reducing this burden, to Department of Defense, Washington Headquarters Services, Directorate for Information SPONSORING/MONITORING AGENCY NAME(S) AND ADDRESS(ES) 10. SPONSORING/MONITORING AGENCY ACRONYM(S)Air Force Government is joint author of the work and has the right to use, modify, reproduce, release, perform, display, or disclose the work. ABSTRACTAir Force currently has a strong need for the development of compact capacitors which are mechanically robust and thermally stable for operation in a variety of aerospace power conditioning applications. These applications demand better reliability and flexibility in the power system design as well as decreased thermal load for electronic system cooling. While power conditioning capacitors typically use polycarbonate (PC) dielectric films in wound capacitors for operation from -55 ºC to 125 ºC, future power electronic systems would require the use of polymer dielectrics that can reliably operate at elevated temperatures up to or even exceeding 350 ºC.The focus of this research is the generation and dielectric evaluation, up to 350 ºC, of metallized free-standing thin films derived from high temperature polymer systems such as fluorinated polybenzoxazoles (6F-PBO) and fluorenyl polyesters incorporating diamond-like hydrocarbon units (FDAPE). The discussion will be centered mainly on variable temperature dielectric measurements of film capacitance, dissipation factor and insulation resistance, and the effects of thermal cycling on film dielectric performance. Initial studies clearly point to the dielectric stability of these films for high temperature power conditioning applications, as indicated by relatively minor variations (~ 2 %) in measured film capacitance over the entire range of temperatures studied. Comparison will also be made with the reported variable temperature dielectric properties of the state-of-the-art high temperature FPE films. SUBJECT TERMS ABSTRACTAir Force currently has a strong need for the development of compact capacitors which are mechanically robust and thermally stable for operation in a variety of aerospace power conditioning applications. These applications demand better reliability and flexibility in the power system design as well as decreased thermal load for electronic system cooling. While power conditioning capacitors typically use polycarbonate (PC) dielectric films in wound capacitors for operation from -55ºC to 125ºC, future power electronic systems would require the use of polymer dielectrics that can reliably operate at elevated temperatures up to or even exceeding 350ºC.The focus of this research is the gene...
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