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Joining of dissimilar metallic materials gives rise to the production of components with improved properties. At the joint interface, the formation of brittle intermetallic layers might deteriorate the component application. Therefore, its formation and growth must be well understood and carefully controlled. Numerical simulations assist in the determination of processes parameters to obtain the desired bond characteristics. In solid-liquid joining processes, the melt movement plays an important role und must be accounted in the simulations. In this paper, a mathematical model at the continuum scale is used for the description of the interface formation during solid-liquid joining. The description of convection and advection of the molten alloy and the dissolution of the solid substrate are of interest. The substrate dissolution into the melt alters the local composition of the molten alloy, leading to precipitation of intermetallic compounds on the substrate surface during the solidification process. To account for these phenomena, convection heat transfer with phase transformation and diffusion and reaction at the solid-liquid interface are considered in the mathematical model that is based on conservation equations of mass, momentum, energy and species. The different scale problem is solved by applying a dynamic mesh refinement at the interface to accurately solve the intermetallic layer growth. The model was implemented in OpenFoam® and simulation results for the intermetallic layer thickness as a function of solid substrate temperature (Ts) for compound casting between initially liquid Al and a solid Cu substrate are presented. In general, for Ts initial value ranging from 400 to 700 °C while keeping the initial Al melt temperate at 750 °C, the intermetallic layers thickness increases as Ts increases.

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