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This paper discusses results obtained in high-rate laser microprocessing by using a high average power high-pulse repetition frequency ultrashort pulse laser source in combination with an in-house developed polygon scanner system. With the recent development of ultrashort pulse laser systems supplying high average power of hundreds watts and megahertz pulse repetition rates, a significant increase of the productivity can potentially be achieved in micromachining. This permits upscaling of the ablation rates and large-area processing, gaining increased interest of the ultrashort pulse laser technology for a large variety of industrial processes. However, effective implementation of high average power lasers in microprocessing requires fast deflection of the laser beam. For this, high-rate laser processing by using polygon scanner systems provide a sustainable technological solution. In this study, a picosecond laser system with a maximum average power of 100 W and a repetition rate up to 20 MHz was used. In raster scanning using the polygon scanner, the laser beam with a focus spot diameter of 44 μm was deflected with scan speeds of several hundred meters per second. The two-dimensional scanning capability of the polygon scanner supplied a scan field of 325 × 325 mm. The investigations were focused on high-rate large-area laser ablation of technical grade stainless steel as well as selective thin film ablation from bulk substrates. By variation of the processing parameters laser fluence, as well as temporal and spatial pulse-to-pulse distance, their impact onto the ablation process was evaluated with respect to the ablation rate, processing rate, surface quality, and ablation efficiency.

The interaction of ultrashort pulsed laser radiation with intensities of 1013 W cm−2 and above with materials often results in an unexpected high X-ray photon flux. It has been shown so far, on the one hand, that X-ray photon emissions increase proportionally with higher laser power and the accumulated X-ray dose rates can cause serious health risks for the laser operators. On the other hand, there is clear evidence that little variations of the operational conditions can considerably affect the spectral X-ray photon flux and X-ray emissions dose. In order to enhance the knowledge in this field, four ultrashort pulse laser systems for providing different complementary beam characteristics were employed in this study on laser-induced X-ray emissions, including peak intensities between 8 × 1012 W∙cm−2 < I0 < 5.2 × 1016 W∙cm−2, up to 72.2 W average laser power as well as burst/bi-burst processing mode. By the example of AISI 304 stainless steel, it was verified that X-ray emission dose rates as high as H˙′ (0.07) > 45 mSv h−1 can be produced when low-intensity ultrashort pulses irradiate at a small 1 µm intra-line pulse distance during laser beam scanning and megahertz pulse repetition frequencies. For burst and bi-burst pulses, the second intra-burst pulse was found to significantly enhance the X-ray emission potentially induced by laser pulse and plasma interaction.

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