The
seed-mediated growth of noble metal nanostructures with planar
geometries requires the use of seeds lined with parallel stacking
faults so as to provide a break in symmetry in an otherwise isotropic
metal. Although such seeds are now routinely synthesized using colloidal
pathways, equivalent pathways have not yet been reported for the fabrication
of substrate-based seeds with the same internal defect structures.
The challenge is not merely to form seeds with planar defects but
to do so in a deterministic manner so as to have stacking faults that
only run parallel to the substrate surface while still allowing for
the lithographic processes needed to regulate the placement of seeds.
Here, we demonstrate substrate-imposed epitaxy as a viable synthetic
control able to induce planar defects in Au seeds while simultaneously
dictating nanostructure in-plane alignment and crystallographic orientation.
The seeds, which are formed in periodic arrays using nanoimprint lithography
in combination with a vapor-phase assembly process, are subjected
to a liquid-phase plasmon-mediated synthesis that uses light as an
external stimuli to drive a reaction yielding periodic arrays of hexagonal
Au nanoplates. These achievements not only represent the first of
their kind demonstrations but also advance the possibility of integrating
wafer-based technologies with a rich and exciting nanoplate colloidal
chemistry.
The
fundamental understanding of liquid-phase catalytic reactions
is unavoidably complicated when the catalyst is prone to leaching
since questions inevitably arise as to the true nature of the catalyst.
While the catalytic reduction of 4-nitrophenol by borohydride is widely
accepted as a trusted model reaction, it has faced little scrutiny
concerning the potential impact of leached species or the appropriateness
of assigning catalytic activity to the inserted nanostructures without
rigorous experimental verification. Here, we present results from
a spectroscopically monitored split test in which supported silver
catalysts are physically separated from the reactants midway through
the reaction. It is unambiguously demonstrated that the influence
of leaching is far from benign, instead acting to extinguish the catalytic
activity of the inserted nanostructures while giving rise to an unsupported
heterogeneous catalyst that is the true catalytic entity. With only
submonolayer quantities of silver leached from the supported structures,
the unsupported species must be exceedingly catalytic. Moreover, it
is shown that leaching is inherent to aqueous media containing dissolved
oxygen, without which the supported nanostructures remain catalytically
active. With the same nanomaterial being able to act either as a heterogeneous
catalyst or as a reservoir from which leached metal is derived, such
influences have undoubtedly compromised prior studies. We, nevertheless,
capitalize on the sensitivity of 4-nitrophenol reduction to leached
species by using it as a reaction-based indicator able to quantitatively
determine the time dependence of the leaching process and enhancements
to oxidative etching when silver, copper, palladium, platinum, and
gold are exposed to chloride ions.
The functionality of well-tailored nanomaterials can only be retained if they are robust to the environmental factors in which they operate. The inability of Cu to withstand such factors is largely responsible for its current status as a second-tier plasmonic nanomaterial. Herein, it is demonstrated that atomic layer deposition can be used as a pliable technique for the application of oxide coatings to substrate-based Cu nanostructures where suitably protected structures become robust to oxidation, high temperatures, and aqueous, acidic, and alkaline solutions without unduly influencing important plasmonic properties. Moreover, strategies are presented for maximizing plasmonic near-fields and allowing for the transport of hot electrons while maintaining coating integrity. The findings demonstrate that there does not exist a one-solution-fits-all approach but that coating design must follow an application-specific methodology. Within the scope of the investigation, alumina, hafnia, titania, and combinations thereof were all shown to be effective under certain conditions, but where hafnia shows the greatest durability in extreme pH environments and alumina-hafnia multilayers provide Cu with protection from oxidation to temperatures as high as 600 °C. The work advances the use of Cu nanostructures as durable plasmonic materials and provides broad-based strategies for protecting other vulnerable nanomaterials from harsh environments.
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