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In this report, chemical mechanical polishing (CMP) of gallium nitride (GaN) with colloidal silica was studied. It was confirmed that colloidal silica based slurry could be used for gallium face of GaN. Removal rate of GaN was 17 nm/h under typical polishing conditions. An atomically flat surface with Ra = 0.1 nm was achieved after CMP. Detailed observation of the scratch density was done during the CMP process. Cathode luminescence (CL) imaging was used to understand the sub-surface damage induced by mechanical polishing process and its removal by CMP with colloidal silica based slurry. Combining the optical microscope, atomic force microscope (AFM), CL imaging, and reflection high energy electron diffraction (RHEED) observations before, after and at intermediate stages of the CMP process, the schematic model of the removal of scratch and damage layer from Ga-faced GaN substrate by CMP process was proposed.

The possibility of chemical mechanical polishing (CMP) as an intermediate ex-situ surface planarization process for thin-film epitaxy devices has been investigated. The surface quality of the homoepitaxial GaN after a surface pretreatment of CMP on the GaN-on-sapphire template drastically improved as compared to that with the regular homoepitaxial process. In addition, it was found that CMP contributed to a reduction in the dislocation densities in the subsequent homoepitaxial GaN layers. The CMP-treated GaN surface exhibited pits, with an average diameter of 0.3 μm, due to the chemical etching effect of the CMP slurry. These pits are thought to enhance the epitaxial lateral over growth of the GaN thin films, leading to a reduction in the dislocation densities in the homoepitaxial GaN layers.

Downregulation of PRRX1 expression contributes to the poor prognosis of patients with HCC through acquisition of CSC-like properties.

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