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The microstructure of powders that are applicable for electronic materials were studied for some systems in which there is a liquid miscibility gap. The characteristic morphologies of an egg-like core type and a uniform secondphase dispersion are shown in relation to the phase diagram, where thermodynamic calculations are a powerful tool for alloy design and the prediction of microstructure. Typical examples of microstructural evolution and properties of Pb-free solders and Ag-based micropowders with high electrical conductivity produced by a gas-atomizing method are presented.

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