Assessment of neural biocompatibility requires that materials be tested with exposure in neural fluids. Laser bonded microjoint samples made from Ti coated glass substrate and polyimide film (GPI) and titanium foil and polyimide film (TIPI) were evaluated for mechanical performance before and after exposure in artificial cerebrospinal fluid (CSF) for two, four, and 12 weeks at 37 degrees C. These samples represent a critical feature, i.e., the microjoint-a major weakness in the bioencapsulation system. Both material systems showed initial degradation up to 4 weeks which then stabilized afterwards and retained similar strength until 12 weeks. The TIPI system appears to exhibit better overall performance with less degradation compared to its as-received strength. The CSF exposed TIPI samples predominantly failed at the interface, while GPI samples had mixed glass and polyimide substrate and interface failure. The amount of glass failure decreases and interface failure increases with increase in CSF exposure time. The failure mechanism of the as-received (not exposed to CSF) GPI samples under tension was predominantly flexure type failure of the glass substrate.
This paper is devoted to the laser irradiated joints between glass and polyimide. To facilitate bonding between them, a thin titanium film with a thickness of approximately 0.2 μm was deposited on glass wafers using the physical vapor deposition (PVD) process. Two sets of samples were fabricated where the bonds were created using diode and fiber lasers. The samples were subjected to tension using a microtester for bond strength measurements. The failure strengths of the bonds generated using fiber laser are quite consistent, while a wide variation of failure strengths are observed for the bonds generated with diode laser. Few untested samples were sectioned and the microstructures near the bond areas were studied using an optical microscope. The images revealed the presence of a sharp crack in the glass substrate near the bond generated with the diode laser. However, no such crack was observed in the samples made using fiber laser. To investigate further the reasons behind such discrepancy in bond quality, three-dimensional uncoupled finite element analysis (FEA) was conducted for both types of samples. The transient heat diffusion-based FEA model utilizes the laser power intensity distribution as a time dependent heat source to calculate the temperature distribution within the substrates as a function of time.
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