CeO2 layer was epitaxially grown for the first time on both (111) and (100) silicon substrates by vacuum evaporation. Characterization using Rutherford backscattering and reflection high-energy electron diffraction proved that a CeO2 layer on (111) Si has considerably good crystalline quality, whereas that on (100)Si contains a large amount of crystallographic defects, especially in the vicinity of the CeO2/Si interface. Auger electron spectroscopy analysis showed a uniform concentration distribution of Ce and O throughout the epitaxial layer.
This paper proposes a new MOS-gate transistor structure (IEGT) for the first time, that realizes enhanced electron injection so that the carrier distribution takes a form similar to that of a thyristor and a low forward voltage drop is attained even for 4500 V devices.A developed simple analytical one dimensional model can predict a sufficiently accurate current voltage curve and clarifies a new design criterion for IEGT operation, A fabricated 4500 V IEGT realized a 2 . 5 V forward voltage drop at 100 A/cmz. The IEGT had a current density over ten times that of the conventional trench gate IGBT at 2 . 5 V forward voltage drop, An operation mode of IEGT has been theoretically and experimentally confirmed. IEDM Technical b e s t .
CeO2 layers epitaxially grown on (100) silicon substrates by electron-beam evaporation were investigated and proved to have (110) orientation. X-ray diffraction measurements showed the CeO2 layers consist of more than 98% volume fraction of the (110) component. Cross-sectional high-resolution transmission electron microscopy and selected-area electron diffraction clearly verified the above configuration of crystallographic orientations and that the 〈100〉 direction in the CeO2(110) plane is parallel with the 〈110〉 direction in the Si(100) plane. The cross-sectional lattice image clarified the existence of a ∼60-Å-thick intermediate amorphous layer between the CeO2 layer and the silicon substrate. Moreover, the high density of defects such as dislocations and low-angle boundaries that exist in the vicinity of the interface agree well with Rutherford backscattering and channeling measurements.
It is found that epitaxial CeO2 layers with (100) or (110) orientation can be selectively grown on Si(100) substrates by controlling substrate bias in reactive dc magnetron sputtering. Adopting a two step growth method; ultrathin metallic Ce layer deposition at room temperature followed by a silicidation process at 800 °C, and subsequent reactive sputtering in an Ar/O2 mixture environment, the CeO2(100) layer is grown on practical Si(100) surfaces prepared by the usual wet cleaning method.
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