With the fast development in the fields of photovoltaics and integrated circuits, the measurement of surface topographies and micro-scaled defects has attracted intensive interests. However, existing measurement methods are timeconsuming and unsuitable for in-situ detection. Therefore, a fast topographic measurement method is developed based on the deflectometric microscope system. Microscopic deflectometry is an attractive tool due to its high sensibility to surface slopes and large dynamic range of measurement. For the quantitative reconstruction of surface topographies from slopes, an integration method is developed based on the minimum spanning tree, and the integration path is designed based on a sparse representation and a curl map. The robustness and accuracy of the integration method are validated by numerical simulation and experiments. This method can achieve a high measurement accuracy with a high lateral resolution and a depth of field of 90 μm, hereby improving the manufacturing efficiency and quality of opto-electronics functional devices.
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