The introduction of a periodic corrugation into TOLEDs is demonstrated to be effective in relieving the tradeoff between device stability and efficiency, through the cross coupling of the SPPs associated with the Ag cathode and the microcavity modes. The thickness of the Ag cathode for the corrugated TOLEDs was increased from 20 to 45 nm, and both the device lifetime and efficiency are significantly improved. The figure shows a schematic cross section of a red TOLED with periodic microstructure and an operating TOLED with both corrugated and planar area.
Bismuth telluride (Bi 2 Te 3 )-based thermoelectric materials are well-known for their high figure-of-merit (zT value) in the low-temperature region. Stable joints in the module are essential for creating a reliable device for long-term applications. This study used electroless Co−P to prevent a severe interfacial reaction between the joints of solder and Bi 2 Te 3 . A thick and brittle SnTe intermetallic compound layer was successfully inhibited. The strength of the joints improved, and the fracture mode became more ductile; furthermore, there was no significant degradation of thermoelectric properties after depositing the Co−P layer after long-term aging. The result suggests that electroless Co−P could enhance the interfacial stability of the joints and be an effective diffusion barrier for Bi 2 Te 3 thermoelectric modules.
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