The chip-level 1 Â 2 optical interconnects using the polymer vertical splitter developed on a silicon substrate are demonstrated. The 1 Â 2 vertical-splitting configuration is realized using a polymer waveguide terminated at three silicon 45 reflectors. The highfrequency transmission lines combined with the indium solder bumps are developed to flipchip assemble a vertical-cavity surface-emitting laser chip at the input port and two photodetector chips at two output ports. Total transmission loss of À3.26 dB with a splitting ratio of 1 : 1 for the proposed splitter is experimentally obtained. A 10-Gbit/s data transmission with bit error rates better than 10 À12 for two output ports is achieved. It reveals that such chiplevel 1 Â 2 optical interconnects using the polymer vertical splitter are suitable for high-speed data transmission with multiple output ports.
A polymer-waveguide-based optical circuit with two vertical-transition output ports for the optical interconnects is demonstrated on a silicon substrate. Such a 1 Â 2 vertical splitter is realized using a polymer waveguide monolithically integrated with three silicon 45 microreflectors. The vertical-cavity surface-emitting laser chip assembled at the input port and two multimode fibers located at two output ports are arranged to demonstrate a two-port optical proximity coupling of the off-chip optical interconnects based on the proposed splitter. The optical insertion loss of À6.6 dB is experimentally obtained for the proposed 1 Â 2 vertical splitter with a splitting ratio of 1.3 : 1. The clearly 10-Gb/s optical eye patterns at both output ports verify that the 1 Â 2 vertical splitter is suitable for the optical interconnects with multiple output ports.
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