We showed that a thermally stable europium complex can be used as a fluorescence probe to characterize glass-transition behavior for polymers. This kind of simple but novel work opens many possibilities of measurements for physical properties of polymers at higher temperatures.
Epoxy-based flux has been developed to improve the impact reliability of the lead-free solder ball joint. The improvement effect of impact properties of the solder ball joint with epoxy-based flux was examined. Residue of epoxybased flux is left around the solder ball joint and reinforces the joint. Thus interfacial fracture is inhibited and solder fracture increases. The solder ball joint with epoxy-based flux has superior shear strength and impact toughness compared with the joint fabricated with conventional rosin-based flux. Keywords-epoxy-based flux; solder ball joint; Sn-3Ag-0.5Cu; ball shear test; impact properties I.
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