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This study aims to investigate additively manufactured Ti6242S specimens compared with the widely used Ti64 alloy with a special focus on microstructure and mechanical properties as well as the impact of subsequent heat treatments. As the Ti6242S alloy, which belongs to the family of near‐α Ti‐alloys, is often used at higher service temperatures, uniaxial tensile tests are performed at a room temperature up to 500 °C. By means of optical and electron microscopy, it is found that the as‐built microstructure consists of acicular α′ martensite, which decomposes to α + β during the subsequent heat treatment. A special focus on the prior microstructure shows that the Ti6242S alloy has a small β grain size, which influences the resulting α′ microstructure after the β → α′ phase transformation. Furthermore, the mechanical properties at room temperature as well as elevated temperatures exceed the values for selective laser melted Ti64 and conventionally cast Ti6242 material. The heat‐treated Ti6242S specimens exhibit an ultimate tensile strength of about 1213 MPa including a ductility of 11.3% at room temperature. These values may path the way to a substitution of the widely used Ti64 alloy by the near‐α Ti6242S alloy, especially for highly loaded components at elevated temperatures.

A major obstacle in the utilization of Mo thin films in flexible electronics is their brittle fracture behavior. Within this study, alloying with Re is explored as a potential strategy to improve the resistance to fracture. The sputter-deposited Mo1−xRex films (with 0 ≤ x ≤ 0.31) were characterized in terms of structural and mechanical properties, residual stresses as well as electrical resistivity. Their deformation behavior was assessed by straining 50 nm thin films on polyimide substrates in uniaxial tension, while monitoring crack initiation and propagation in situ by optical microscopy and electrical resistance measurements. A significant toughness enhancement occurs with increasing Re content for all body-centered cubic solid solution films (x ≤ 0.23). However, at higher Re concentrations (x > 0.23) the positive effect of Re is inhibited due to the formation of dual-phase films with the additional close packed A15 Mo3Re phase. The mechanisms responsible for the observed toughness behavior are discussed based on experimental observations and electronic structure calculations. Re gives rise to both increased plasticity and bond strengthening in these Mo-Re solid solutions.

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Improving the interface stability for nanosized thin films on brittle substrates is crucial for technological applications such as microelectronics because the so-called brittle− ductile interfaces limit their overall reliability. By tuning the thin film properties, interface adhesion can be improved because of extrinsic toughening mechanisms during delamination. In this work, the influence of the film microstructure on interface adhesion was studied on a model brittle−ductile interface consisting of nanosized Cu films on brittle glass substrates. Therefore, 110 nm thin Cu films were deposited on glass substrates using magnetron sputtering. While film thickness, residual stresses, and texture of the Cu films were maintained comparable in the sputtering processes, the film microstructure was varied during deposition and via isothermal annealing, resulting in four different Cu films with bimodal grain size distributions. The interface adhesion of each Cu film was then determined using stressed Mo overlayers, which triggered Cu film delaminations in the shape of straight, spontaneous buckles. The mixed-mode adhesion energy for each film ranged from 2.35 J/m 2 for the films with larger grains to 4.90 J/m 2 for the films with the highest amount of nanosized grains. This surprising result could be clarified using an additional study of the buckles using focused ion beam cutting and quantification via confocal laser scanning microscopy to decouple and quantify the amount of elastic and plastic deformation stored in the buckled thin film. It could be shown that the films with smaller grains exhibit the possibility of absorbing a higher amount of energy during delamination, which explains their higher adhesion energy.