A joining technique for oxide ion conducting ceramics, such as yttria-stabilized zirconia, was developed, utilizing oxidation of transiently formed aluminum melt. Two yttria-stabilized zirconia (YSZ) blocks were joined via Al/Ni alloy/Al interlayers at 1273 to 1473 K for 3.6 to 28.8 ks in a vacuum (< 0.2 Pa) with an applied load of 80 MPa. The average fracture strength increased with increasing the joining time and temperature. A strong four-point bend strength of 170 MPa was obtained for the specimen joined at 1473 K for 14.4 ks, which was fractured at YSZ block. Alumina interlayer, which is expected to act as a protective layer for further oxidation of Ni alloy, was formed between YSZ and Ni alloy in the specimen after joining.
Diffusion bonding and thermal fracture between Si 3 N 4 ceramic and stainless steel (SUS316) were investigated. Sintered Si 3 N 4 ceramics were fabricated by hot-pressing of a-Si3N 4 powder with 5wt% Yz03 and 5 -1 Owt% Ah0 3 . Bonding between SUS316 plate with 1 mm thick and Si 3 N 4 specimens was carried out at 8 -24 MPa and at 1000° -1300°C for 1 h in vacuum. Thermal decomposition of the bonded specimen in air was followed by acoustic emission and high-temperature microscope. Bonding between SUS and ShN 4 was achieved by heating at 1150 and 1200°C in vacuum. When the bonded sample was heated in air, small cracking was formed at 700°C at the interface between SUS and Si3N 4 , followed by decomposition of the bonded sample at 900°C.
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