In order to develop a micropump driven by shape memory actuation, we require a TiNi diaphragm structure with a cap to act as a chamber for applying bias pressure to the diaphragm. With the purpose of realizing such a structure, we studied the photoetching of TiNi thin film on a Si substrate and two bonding processes -diffusion bonding and anodic bonding-for patterning and assembling. TiNi thin film deposited on Si substrates by flash evaporation was etched in HF/HNO3/H20 solutions using negative photoresist masks. HF:FINO3:H201 : 1 :4 solution proved capable of etching it at a rate of about 30 nm/s without etching of the Si substrate. Patterned TiNi thin film of 6 tm in thickness on a Si substrate was diffusion bonded to another Si substrate coated with the same TiNi thin film at a thickness of 300 nm. Bonding was conducted in a vacuum at a bonding pressure of 210 MPa. TiNi-TiNi diffusion bonding was obtained at temperatures of more than 300°C. A 4-point bending test revealed that the bond strength of specimens bonded at 400°C was 15-20 MPa. Anodic bonding was conducted between TiNi thin film on a Si substrate and a Pyrex 7740 glass substrate at an applied voltage of 600 V. Two substrates were bonded in nitrogen ambient at temperatures of more than 350°C, giving a bond strength of about 15 MPa at 400°C bonding.
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