The scan-projection exposure of small-diameter pipe surfaces was investigated using a newly developed prototype exposure system. It is necessary to secure a very large depth of focus for printing thick resist patterns on round pipe surfaces with a roughness larger than that of semiconductor wafers. For this reason, a camera lens with a low numerical aperture of 0.089 was used as a projection lens, and the momentary exposure area was limited by a narrow slit with a width of 800 µm. Thus, patterns on a flat reticle were replicated on a pipe surface by linearly moving the reticle and rotating the pipe synchronously. By using a reticle with inclined line-and-space patterns, helical patterns with a width of 30 µm were successfully replicated on stainless-steel pipes with an outer diameter of 2 mm and coated with a 10-µm-thick negative resist. The patterns replicated at the start and stop edges were smoothly stitched seamlessly.
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