This paper presents a finite element algorithm for two-dimensional nonlinear inverse heat conduction analysis. The proposed method is capable of handling both unknown surface heat flux and unknown surface temperature of solids using temperature histories measured at a few discrete point. The proposed algorithms were used in the study of the thermofracture behavior of leaking pipelines with experimental verifications.
Cost effective packaging and robust reliability are two critical factors for successful commercialization of MEMS and microsystems. While packaging contributes to the effective production cost of MEMS devices, reliability addresses consumer's confidence in and expectation on sustainable performance of the products. There are a number of factors that contribute to the reliability of MEMS; packaging, in particular, in bonding and sealing, material characterization relating to operating and environmental conditions, credible design considerations, the techniques for mitigating intrinsic stresses/strains induced by fabrications and testing for reliability are a few of these factors. This paper will offer an overview of these factors with proposed resolutions to issues relating to the reliability of these products.
A BSTRACT This paper will share my experience with readers in developing and implementing a new mechatronics curriculum stem in an existing mechanical engineering program at the undergraduate level. Also included are the strategies in initiating, developing and implementing this curriculum stem.
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