A new MCM-D technology which enables reliable fabrication of high-performance and low cost MCM's has been developed. The technology is based on CuPhotosensitive-BCB thin-tilm multilayer structure. The fabrication process is reduced by using the newly developed Photosensitive-BCB, with a conventional photolithography process. The flexibility on design rules is allowed, because the C a C B structure has the advantages of excellent planarization and low electrical resistance of signal line.The following long-term reliability tests were successfully done: thermal cycle (-45"C/125"C), high-temperature aging at 125"C, and high-temperature humidity (85"C/?35%). A prototype of the high density RISC module fabricated with the developed technology passed all the long-term reliability tests. The excellent electrical performance was also proved through the signal transmission tests with the prototype module.Zndex Terms-Multichip module, MCM-D, benzocyclobutene, photosensitive, RISC module.
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