Polyvinylidene fluoride (PVDF) is a polymer prized for its unique material properties, including a high resistance to corrosive acids such as HCL and HF and its piezoelectric potential based on the proper microstructure arrangement. In this work, the effects of fused filament fabrication (FFF) routine parameters on printed PVDF film properties were investigated using a variety of experimental methods. The influence of in-fill angle (0°, 45°, and 90°) on the effective Young"s Modulus, Poisson"s ratio, and yield strength were evaluated using tensile testing and a digital image correlation (DIC) analysis. The phase content, in particular the β-phase amount, within the semi-crystalline PVDF films was determined as a function of processing parameters using the FTIR method. Considered parameters included the extrusion temperature, horizontal speed, in-situ applied hot end voltage, and bed material. Results showed that higher β-phase content was associated with lower extrusion temperatures, faster extrusion rates, and higher hot end voltages. While all "as printed" films demonstrated little to no measurable piezoelectricity, PVDF films printed with a high β-phase content and subjected to a post-printing corona poling procedure showed a small, but consistent piezoelectric response. Based on a static deflection cantilever beam experiment, the d 31 coefficient of the poled specimens was estimated at 1.19 pm/V.
Cracking is a notorious issue with sol-gel PZT thin films, and film failure in this manner is difficult to reliably predict due to constantly evolving mechanical properties. In this work, two non-contact experimental methods are used to quantify the stiffness response of PZT sol-gel during thermal loading and the influence of solution additives, such as lactic acid and gycerol. The mechanical properties are determined using a digital image correlation method to measure strain and wafer curvature measurements to estimate bi-axial stress. Results show the transition from a compliant response to more glassy behavior. The importance of this changing stiffness is shown for a specific application of a buckled MEMS actuator and in relation to adhesion based failure modes.
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