Quantum dots (QDs), with their excellent photoluminescence, narrow emission linewidth, and wide color coverage, provide unrivaled advantages for advanced display technologies, enabling full-color micro-LED displays. It is indeed critical to...

Articles you may be interested inMechanism of laser-induced nanomodification on hydrogen-passivated Si(100) surfaces underneath the tip of a scanning tunneling microscope Nanometer-scale oxide patterns were fabricated on H-passivated Si using a scanning tunneling microscopy ͑STM͒ in air. We found that the optimum bias voltage to generate clean and uniform oxide patterns depends on the composition of the tip material rather than on the tip head sharpness. For tungsten tips, oxide patterns with the desired geometrical features can be obtained at bias voltages ranging from Ϫ0.8 to Ϫ1.2 V, while for platinum-iridium tips, the bias voltages lie between Ϫ1.5 and Ϫ2.5 V at a fixed tunneling current of 2.0 nA. These biases correspond to the working voltage generating the oxide pattern with the lowest apparent depth. Beyond these voltage ranges, tip scratching on the sample surface or field-induced mass transfer from the tip might occur, as evidenced by tip wearing and the contamination of debris of tip material in the vicinity of the patterns. On the other hand, the tip head sharpness affects the width and the height of line patterns. When extremely fine oxide lines were desired, a sharp tip has to be used for STM patterning.

We investigated the etching characteristics of hydrogen iodide (HI) neutral beam etching (NBE) of GaN and InGaN and compared with Cl2 NBE. We showed the advantages of HI NBE vs Cl2 NBE, namely: higher InGaN etch rate, better surface smoothness, and significantly reduced etching residues. Moreover, HI NBE was suppressed of yellow luminescence compared with Cl2 plasma. InClx is a product of Cl2 NBE. It does not evaporate and remains on the surface as a residue, resulting in a low InGaN etching rate. We found that HI NBE has a higher reactivity with In resulting in InGaN etch rates up to 6.3 nm/min, and low activation energy for InGaN of approximately 0.015 eV, and a thinner reaction layer than Cl2 NBE due to high volatility of In- I compounds. HI NBE resulted in smoother etching surface with a root mean square average (rms) of 2.9 nm of HI NBE than Cl2 NBE (rms: 4.3 nm) with controlled etching residue. Moreover, the defect generation was suppressed in HI NBE vs. Cl2 NBE, as indicated by lower yellow luminescence intensity increase after etching. Therefore, HI NBE is potentially useful for high throughput fabrication of μLEDs.

In this study, we dissolved hole transport layer (HTL) material NPB in THF (tetrahydrofuran) solvant, and spin-coated the N,N'-Bis(naphthalene-l-yl)-N,N'-bis(phenyl)-benzidine (NPB) solution on the surface of Indium Tin Oxide (ITO) anode to enhance the luminance efficiency and lifetime of flexible phosphorescent organic light emitting diodes (POLEDs), where the 2,2',2''-(1,3,5-Benzinetriyl)-tris(1-phenyl-1-H-benzimidazole) (TPBi) was employed as hole blocking layer (HBL) and its thickness was optimized. Such an improvement in the device performance was attributed to the improved hole-electron balance. Finally, we employed 2,9-Dime-thyl-4,7-dphenyl-1,10-phenanhroline (BCP) or TPBi as hole blocking layer. The maximum luminance efficiency reaching 24.4 cd/A can be obtained.