<div class="section abstract"><div class="htmlview paragraph">The electronic content in automotive has increased over recent years and expected to contribute about 50% of the total vehicle cost by 2030. The semiconductor research indicates that focus is on enhancing the functionality of single device and miniaturizing of components to reduce the electronic module size. It is to be ensured, that devices in automotive electronic modules should be within its allowable temperature limit while operating at harsh environment. The accurate virtual simulations using CAE tools prior to proto build can assist in understanding the design risks upfront and aids in arriving at a reliable thermal mitigation solution. The prediction accuracy of thermal simulation is driven by the inputs and modeling approach used in the analysis. Current automotive electronic product development trend indicates, chip development and thermal design of electronics module goes in parallel. Hence the access of device intricate details and accurate power estimation for thermal simulation is not feasible during initial design phase. An electronic module will have multiple devices and modeling each device in detail along with explicit PCB trace modeling requires huge computational resource and time consuming. This indicates that simplified modeling techniques assisted with engineering assumptions are essential for virtual simulation that creates inevitable uncertainty in temperature prediction. In this study a generic automotive electronics system is used as an example to showcase the influence of uncertainty factors such as modeling techniques, power input load and boundary condition on thermal simulation. High fidelity thermal simulation model is used as reference and DOE studies are performed at different levels for the identified uncertainty factors. The uncertainty factors are studied individually and as combination to understand its influence in temperature prediction and its findings are highlighted. The approach showcased in this work can be adapted to understand the influence of uncertainty factors on thermal simulation for any automotive electronic module.</div></div>
<div class="section abstract"><div class="htmlview paragraph">In modern automobiles a complex network of electronic sensors and controls is being integrated for increased comfort, convenience, and safety. All of these needs to be designed for the stringent environmental condition requirements. Environmental tests used for validation of product primarily consists of combination of Vibration load, Temperature and Humidity. Failures induced by vibration Load and temperature cycling are fairly well understood and often simulation can help design team to understand weakness in design and evaluate design options to mitigate it. However, Humidity and temperature (cyclic or constant) are critical as well referred as Climatic tests. The purpose of climatic tests are to assess the ability of a product to operate reliably under condensing conditions. Unlike other environmental test where there are visual clues of something broken, these test could lead to failure without any visual clues. Failures are intermittent in nature as they are driven (among other things) by presence of water on Printed Circuit Board (PCB). With moisture or water present on board they might malfunction but fault will disappear with evaporation of water. Examples of these failures are presence of dendrites due to Electrochemical migration (ECM), aqueous corrosion or sudden malfunction of intermittent nature. These are primarily resolved after actual validation test and almost no simulation is performed for up-front prediction of possible design issues. Hence there is a fundamental need to understand simulation of climatic test and predicting the regions of condensation on PCB. The objective of this paper is to demonstrate simulation methodology to predict the moisture condensation on PCB during combined temperature humidity test. The scope of the study focuses on qualitative correlation of the simulation predicted condensation location and experimentally observed results to build confidence in the simulation approach. The design sensitivity study also has been conducted to investigate the variation in response due to change in environmental and design conditions like device power numbers, device switch on and off frequency, Thermal cycling ramp rate and ambient humidity.</div></div>
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