The transparent conductive
electrode (TCE) is a key component of
organic light-emitting diodes (OLEDs). High-resolution printed metal
grids are a promising alternative to indium tin oxide (ITO). We present
results for evaporated OLEDs with a printed copper (Cu) grid with
line width below 3 μm. The use of a thick doped hole injection
layer (HIL) prevented electrical shorts and resulted in good quality
OLEDs with acceptable leakage current. We report a detailed analysis
of the microscopic uniformity of light emission and compare the measured
data with simulations based on finite element modeling (FEM) to investigate
various factors that contribute to differences between the Cu grid
OLED and ITO reference device. This insight resulted in design rules
that enable a luminance of the Cu grid OLED that can potentially equal
that of an ITO-based equivalent OLED by using a very fine pitch and
narrow line width of 5 μm and 250 nm, respectively, within the
capabilities of state-of-the-art printing technology.
We present a thin‐film dual‐layer bottom barrier on PI that is compatible with 350°C backplane processing for OLED displays. We demonstrate OLEDs that survive bending over 0.5 mm radius for 10.000x. Furthermore, we show compatibility of the bottom barrier with the backplane process by fabricating AMOLED displays on GEN1‐sized substrates.
There is a large potential market for flexible OLED Lighting and signage, however this requires to scale up present laboratory processes towards low cost, large area printing technologies. This presentation will compare lab scale made spin coated OLEDs on glass with ink jet and gravure printed OLEDs on foils.
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