Utilizing a multilayered composite approach, we have designed and constructed a new class of artificial materials for thermal conduction. We show that an engineered material can be utilized to control the diffusive heat flow in ways inconceivable with naturally occurring materials. By shielding, concentrating, and inverting heat current, we experimentally demonstrate the unique potential and the utility of guiding heat flux.

Utilizing a non‐resonant graded material consisting of an array of artificially patterned superconducting and soft ferromagnetic elements, we construct a dc magnetic cloak. When an external dc magnetic field is applied, we find that the interior of the cloak is completely shielded while the exterior field remains unperturbed, as if the cloak and the cloaked region are just an empty space.

We have developed a heat shield based on a metamaterial engineering approach to shield a region from transient diffusive heat flow. The shield is designed with a multilayered structure to prescribe the appropriate spatial profile for heat capacity, density, and thermal conductivity of the effective medium. The heat shield was experimentally compared to other isotropic materials.Comment: 8 pages, 5 figures, 1 table, accepted on Applied Physics Lette

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We report a new kind of experiment in which we take an array of nanoscale apertures that form a superfluid (4)He Josephson junction and apply quantum phase gradients directly along the array. We observe collective coherent behaviors from aperture elements, leading to quantum interference. Connections to superconducting and Bose-Einstein condensate Josephson junctions as well as phase coherence among the superfluid aperture array are discussed.

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Abstract. Superconducting single flux quantum (SFQ) circuits can process information at extremely high speeds, in the range of hundreds of GHz. SFQ circuits are based on Josephson junction cells for switching logic and ballistic transmission for transferring SFQ pulses. Multi-chip modules (MCM) are often used to implement larger complex designs, which cannot be fit onto a single chip. We have optimized the design of wideband interconnects for transferring signals and SFQ pulses between chips in flip-chip MCMs and evaluated the importance of several design parameters such as the geometry of bump pads on chips, length of passive micro-strip lines (MSL)s, number of corners in MSLs as well as flux trapping and fabrication effects on the operating margins of the MCMs. Several test circuits have been designed to evaluate the above mentioned features and fabricated in the framework of 4.5-kA/cm 2 HYPRES process. The MCMs bumps for electrical connections have been deposited using the waferlevel electroplating process. We have found that, at the optimized configuration, the maximum operating frequency of the MCM test circuit, a ring oscillator with chip-to-chip connections, approaches 100 GHz and is not noticeably affected by the presence of MCM interconnects, decreasing only about 3% with respect to the same circuit with no inter-chip connections.

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