During the repair of compound skull fractures or penetrating wounds to the brain, removal of significant portions of the skull may be required. Conventional prefabricated alloplastic implants require the use of complicated procedures during surgery, which can endanger a patient. Since prior rehearsals of the surgery are next to impossible, the surgery is usually complicated and lengthy. This paper aims to outline the importance of rapid prototyping (RP) in medicine, and also it details the use of RP for a cranioplastic surgery that was conducted in the South East Asian region. RP offers an easier way to design customized implants and manufacture them within a very short period. Rapid Prototyping can be used as an effective tool to generate complex 3D medical models from computed tomographic (CT) images. The models can be used for didactic purposes, as it helps the surgeons plan and rehearse the surgery well in advance. The RP prototype was used to successfully complete a cranioplastic surgery and realize the desired results. The operation time was also significantly reduced.
If you would like to write for this, or any other Emerald publication, then please use our Emerald for Authors service information about how to choose which publication to write for and submission guidelines are available for all. Please visit www.emeraldinsight.com/authors for more information. About Emerald www.emeraldinsight.comEmerald is a global publisher linking research and practice to the benefit of society. The company manages a portfolio of more than 290 journals and over 2,350 books and book series volumes, as well as providing an extensive range of online products and additional customer resources and services.Emerald is both COUNTER 4 and TRANSFER compliant. The organization is a partner of the Committee on Publication Ethics (COPE) and also works with Portico and the LOCKSS initiative for digital archive preservation. AbstractPurpose -The objective of this research is to address issues that relate to the assembly of Sn/Ag/Cu bumped flip chips. Design/methodology/approach -Flip chips bumped with Sn/Ag/Cu bumps were assembled onto different lead-free surface finishes at lead-free soldering temperatures. Sensitivity to fluxes, reflow profiles, pad finishes and pad designs were all investigated and the potential consequences for assembly yields were calculated numerically. Findings -Soldering defects, such as incomplete wetting and collapse and poor self-centring were observed in the assemblies. Defect levels were sensitive to contact pad metallurgy and flux type, but not to flux level and reflow profile within the ranges considered. Owing to a particularly robust substrate-pad design, defects observed in this work were limited to incomplete wetting and collapse, as well as poor self-centering.Research limitations/implications -The scope of this work is limited to the lead-free fluxes available at the time of research. A switch to lead-free solder alloys in flip chip assemblies raises concerns with respect to the compatibilities of materials and the quality of soldering that is achievable. While this may be less of an issue in the case of larger area array components, such as ball grid arrays and chip scale packages, it is more of a concern for applications that use flip chips due to the smaller size of the solder spheres. Assembly yields tend to become more sensitive to the reduced collapse of the joints. More work is essential to investigate the potential benefits of more active lead-free fluxes, both no-clean tacky and liquid fluxes, in reducing or eliminating soldering defects. Originality/value -The paper offers insights into assembly issues with Sn/Ag/Cu bumped flip chips.
It is well established that Pb free alloys tend to solder less readily than Sn/Pb. It is not clear that this is always a major problem, but two factors combine to make it more of a concern for flip chip than for other applications. Not surprisingly, wetting and spreading appears to become less effective as the solder volume is reduced and a larger fraction of it is near the surface. At the same time assembly yields tend to become more sensitive to this. The present paper addresses the assembly of flip chips with Sn/Ag/Cu bumps onto Ni/Au and OSP coated copper pads on organic substrates. Soldering defects observed included incomplete wetting and collapse, as well as poor self centering. The sensitivity to fluxes, reflow profiles, and substrate pads were investigated and potential consequences for assembly yields calculated numerically.
The infrastructure required for fiber optic communication systems to become truly affordable includes a supply of individual components at a price that can only be achieved through full automation of the packaging processes. We illustrate the manufacturing of typical passive photonics components through the case of a polarization dependent optical isolator. Identification of the available options here requires an understanding of the underlying optical principles and functionality, as well as of the influences of process variations and part tolerances on performance. Issues relating to cost, ease of manufacturing and automation are discussed. These include component design and materials selection, as well as questions of intellectual property.
scite is a Brooklyn-based organization that helps researchers better discover and understand research articles through Smart Citations–citations that display the context of the citation and describe whether the article provides supporting or contrasting evidence. scite is used by students and researchers from around the world and is funded in part by the National Science Foundation and the National Institute on Drug Abuse of the National Institutes of Health.
hi@scite.ai
10624 S. Eastern Ave., Ste. A-614
Henderson, NV 89052, USA
Copyright © 2024 scite LLC. All rights reserved.
Made with 💙 for researchers
Part of the Research Solutions Family.